Projects

The project "NewLPCVD" focuses on acquiring a modern coating/deposition system to build and expand capabilities in the fields of photonics and micromechanical components.

In the “DORMO” project, researchers are developing smart sensor modules for use in mobile X-ray systems that optimize X-ray imaging and minimize the impact of motion artifacts during radiological examinations. The aim is to improve point-of-care X-ray diagnostics while minimizing radiation exposure for both patients and users.

In the project print4POC+, a technology platform for the functional printing of actuating and sensing functional elements in microfluidic point-of-care systems is being developed. The aim is to substitute cost- and resource-intensive subtractive processes, such as lithography or the integration of discrete components, with direct functional printing.

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. Fraunhofer ENAS contributes technological expertise in three key areas: System Technology Co-Optimization (STCO) design development, advanced manufacturing for interposer and chiplet integration, as well as comprehensive characterization, test and reliability (CTR) methodologies.

The aim of the KMU-innovativ project ALPACA is the simulation-supported further development of an innovative equipment and process technology that enables efficient and precise processing at the atomic layer level.

In the emerging Advanced Air Mobility (AAM), the ability to automatically land and fly is becoming increasingly important. New aircraft concepts require highly accurate velocity and position information with high integrity. MEMS-based sensing with Inertial Reference System (IRS) performance can make a significant contribution.

The project “HaloFreeEtch” aims to revolutionize the semiconductor manufacturing industry by developing new, sustainable, halogen-free etching processes for silicon and silicon oxide. Traditional industrial plasma etching processes rely on halogens, which pose significant environmental and health risks. By replacing these with more sustainable alternatives, the project seeks to reduce the carbon footprint and improve the overall sustainability of semiconductor manufacturing.

In the ´KoVoPack´ project, we are working with our partners and using new processes, technologies and systems to develop a complete technology platform that can be used as an efficient, inexpensive way of creating fully integrated electronic systems known as ´System-in-Package´ (SiP) solutions. This means we are also doing important groundwork for creating state-of-the-art communication and entertainment experiences – with the help of 5G and 6G mobile networks.

The goal of the AziTrim project is the further development and optimization of a process chain for the production of variably oriented lattice structures for use in augmented reality (AR) applications.

The SAB project “MIMODI-3D+ - Miniaturized modular digital 3D+ sensor system with optimized packaging for intelligent condition monitoring” can make a significant contribution to improve predictive condition and process monitoring in highly dynamic systems with new approaches in sensor technology, assembly and connection technology as well as data acquisition and processing.