The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. Fraunhofer ENAS contributes technological expertise in three key areas: System Technology Co-Optimization (STCO) design development, advanced manufacturing for interposer and chiplet integration, as well as comprehensive characterization, test and reliability (CTR) methodologies.
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Fraunhofer Institute for Electronic Nano Systems