Projects

The SAB project “MIMODI-3D+ - Miniaturized modular digital 3D+ sensor system with optimized packaging for intelligent condition monitoring” can make a significant contribution to improve predictive condition and process monitoring in highly dynamic systems with new approaches in sensor technology, assembly and connection technology as well as data acquisition and processing.

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. Fraunhofer ENAS contributes technological expertise in three key areas: System Technology Co-Optimization (STCO) design development, advanced manufacturing for interposer and chiplet integration, as well as comprehensive characterization, test and reliability (CTR) methodologies.

Semiconductor products are essential components for modern electronic parts across a wide range of application fields, with demand constantly rising. Consequently, the complexity and requirements for the design, development, and manufacturing of semiconductors are increasing permanently. This poses new challenges to existing manufacturing and development methods and leads to a growing need for powerful computing resources to process extensive data sets and complex algorithms in a very short time.

GraSonics is a project by three partners from three countries (Czech Republic, Germany, and Poland) that brings together expertise in the fields of graphene, MEMS, and ultrasound.

Single-photon sources are essential components for quantum communication, quantum cryptography, and quantum sensing. The goal of the DeLiQuat project is the development of deterministic, i.e., specifically electrically excitable, single-photon sources based on quantum dots.

The aim of the KMU-innovativ project ALPACA is the simulation-supported further development of an innovative equipment and process technology that enables efficient and precise processing at the atomic layer level.

In the SenMooVe project, a sensor-based solution is being developed to continuously monitor air quality and occupancy. The collected data will be processed using AI methods to assess current and forecasted safety, and the results will be transmitted to existing IT systems of the public transport partners for communication to passengers. This significantly improved data situation will create a real-time data-based decision-making foundation for public transport users, companies, and authorities, ultimately enhancing safety in public transport. Additionally, adaptive control of ventilation and air conditioning can improve sustainability in public transport.

The project "NewLPCVD" focuses on acquiring a modern coating/deposition system to build and expand capabilities in the fields of photonics and micromechanical components.

In the “DORMO” project, researchers are developing smart sensor modules for use in mobile X-ray systems that optimize X-ray imaging and minimize the impact of motion artifacts during radiological examinations. The aim is to improve point-of-care X-ray diagnostics while minimizing radiation exposure for both patients and users.

In the project print4POC+, a technology platform for the functional printing of actuating and sensing functional elements in microfluidic point-of-care systems is being developed. The aim is to substitute cost- and resource-intensive subtractive processes, such as lithography or the integration of discrete components, with direct functional printing.