Projects

Overview about publicly-funded projects at Fraunhofer ENAS

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  • In the SenMooVe project, a sensor-based solution is being developed to continuously monitor air quality and occupancy. The collected data will be processed using AI methods to assess current and forecasted safety, and the results will be transmitted to existing IT systems of the public transport partners for communication to passengers. This significantly improved data situation will create a real-time data-based decision-making foundation for public transport users, companies, and authorities, ultimately enhancing safety in public transport. Additionally, adaptive control of ventilation and air conditioning can improve sustainability in public transport.

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  • © Fraunhofer ENAS

    In the project print4POC+, a technology platform for the functional printing of actuating and sensing functional elements in microfluidic point-of-care systems is being developed. The aim is to substitute cost- and resource-intensive subtractive processes, such as lithography or the integration of discrete components, with direct functional printing.

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  • © Fraunhofer Mikroelektronik

    The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. Fraunhofer ENAS contributes technological expertise in three key areas: System Technology Co-Optimization (STCO) design development, advanced manufacturing for interposer and chiplet integration, as well as comprehensive characterization, test and reliability (CTR) methodologies.

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  • © Ines Escherich / Fraunhofer ENAS

    The project “HaloFreeEtch” aims to revolutionize the semiconductor manufacturing industry by developing new, sustainable, halogen-free etching processes for silicon and silicon oxide. Traditional industrial plasma etching processes rely on halogens, which pose significant environmental and health risks. By replacing these with more sustainable alternatives, the project seeks to reduce the carbon footprint and improve the overall sustainability of semiconductor manufacturing.

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  • © Fraunhofer ENAS

    In the ´KoVoPack´ project, we are working with our partners and using new processes, technologies and systems to develop a complete technology platform that can be used as an efficient, inexpensive way of creating fully integrated electronic systems known as ´System-in-Package´ (SiP) solutions. This means we are also doing important groundwork for creating state-of-the-art communication and entertainment experiences – with the help of 5G and 6G mobile networks.

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