Fraunhofer Institute for Electronic Nano Systems
The project “HaloFreeEtch” aims to revolutionize the semiconductor manufacturing industry by developing new, sustainable, halogen-free etching processes for silicon and silicon oxide. Traditional industrial plasma etching processes rely on halogens, which pose significant environmental and health risks. By replacing these with more sustainable alternatives, the project seeks to reduce the carbon footprint and improve the overall sustainability of semiconductor manufacturing.
With the semiconductor industry at the heart of technological innovation, developing sustainable manufacturing processes is crucial for the environment and the industry's future. The “HaloFreeEtch” project intends to position Europe at the forefront of this green transition, contributing to the global effort to reduce environmental impacts and promote sustainable practices.
Fraunhofer ENAS is taking a key role within “HaloFreeEtch” and will support the Center for Micro- and Nanotechnologies (ZfM) of University of Technology Chemnitz as project leader in a strong process engineering cooperation with its proven expertise in the development and optimization of etching processes, enabling the precise structuring of a wide variety of materials. The institute will focus in particular on developing novel methods that are not only environmentally friendly but also meet the performance requirements of modern semiconductor manufacturing. The use of hydrogen and innovative catalysts will enable the replacement of conventional halogen-based processes that pose significant environmental and health risks. Fraunhofer ENAS is thus making a valuable contribution to significantly reducing the sector’s ecological footprint.
“Our research will help redefine semiconductor technology in Europe and lead the industry into a more sustainable future,” says Dr. Karla Hiller, project leader at Fraunhofer ENAS. “We are proud to be part of this groundbreaking project and look forward to advancing the development of halogen-free etching processes.”
About the project “HaloFreeEtch”
The project will be conducted over a period of 48 months and involves several leading European research and industry partners. The results are expected to not only revolutionize semiconductor manufacturing but also enable applications in areas such as microsensors and photonics.
Project details
| Grant Agreement Number: | 101161153 |
| Project Full Title: | “Novel approaches for halogen-free and sustainable etching of silicon and glass” |
| Topic: | HORIZON-EIC-2023-PATHFINDERCHALLENGES-01-04 |
| Start of Date of the Project: | September 1, 2024 |
| Duration: | 48 Months |
| Project Coordinator: | Chemnitz University of Technology |
| EU Contribution: | 3.997.735 Euro |
Partners
- University of Technology Chemnitz
- PlasmaSolve SRO
- Vrije Universiteit Brussel
- Fraunhofer ENAS
- University of Graz
- Warrant Hub – Tinexta Group
- LioniX International BV
For more information about the project, please visit the official webpage: https://halofreeetch.eu/