The ongoing miniaturization and increasing complexity of components in microelectronics necessitate a constant search for new solutions in materials processing. For novel spintronic components used in sensors and memory devices, the precise patterning of multi-layer metal stacks is crucial. A new piece of equipment technology currently under development offers the potential to simplify the production process whilst significantly reducing both costs and space requirements. The aim of the KMU-innovativ project ALPACA is the simulation-supported further development of an innovative equipment and process technology that enables efficient and precise processing at the atomic layer level.
Our project partner:
- SENTECH Instruments GmbH
Project duration: January 1, 2026 – December 31, 2027
Further information can be found here (German only).
Fraunhofer Institute for Electronic Nano Systems