SuperComb – Supercomputing-supported solutions for digitalized manufacturing and supply chains

© Fraunhofer ENAS
Possible technology modules in the SuperComp project

Semiconductor products are essential components for modern electronic parts across a wide range of application fields, with demand constantly rising. The increasing demand for reliable and efficient semiconductors, e.g., in the areas of the Internet of Things (IoT), mobility, or industry, goes hand in hand with a broad portfolio of various technologies in modern semiconductor manufacturing that address diverse applications. Consequently, the complexity and requirements for the design, development, and manufacturing of semiconductors are increasing permanently. This poses new challenges to existing manufacturing and development methods and leads to a growing need for powerful computing resources to process extensive data sets and complex algorithms in a very short time. Therefore, in the joint project SuperComp, led by Infineon Technologies Dresden GmbH & Co. KG (IFD), innovative solutions are being researched to improve the design, development, and manufacturing of complex semiconductor system solutions using advanced methods based on artificial intelligence (AI) and state-of-the-art computing techniques. These technologies have the potential to revolutionize the research, development, and innovation process in the semiconductor industry.

 

Our project partners:

  • Infineon Technologies Dresden GmbH & Co. KG
  • TU Dresden
  • HTW Dresden
  • Hochschule Zittau/ Görlitz
  • Saxony Media Solutions
  • SpiNNcloud Systems GmbH
  • SYSTEMA Systementwicklung GmbH
  • PVA Vision GmbH
  • Wandelbots GmbH

Project duration: September 1, 2025 – August 31, 2028