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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-09-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
2020-11-05_Project_M3Infekt_FraunhoferENAS
2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
2021-03-22 Fraunhofer ENAS at LOPEC 2021
2021_04_30_Smart Systems Integration
2021-05-03 SENSOR+TEST 2021
2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
2021-06-10 Best Paper Award SSI2021
2021-06-04 Press release TKOS FMD
2021-07-01 Press release Miniature spectrometer for the smartphone
2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
2022-01-28_Inductive-Bonding
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FC³ Fuel Cell Conference Chemnitz
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32. Chemnitzer Seminar
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Workshop - Air Pulses without Pressurized Air
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Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
10 Years Fraunhofer ENAS
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MEMS Sensing & Network System 2016
SEMICON Europa 2016
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European 3D Summit 2017
Smart Systems Integration 2017
SEMICON China 2017
LOPEC 2017
HANNOVER Messe 2017
SENSOR+TEST 2017
SEMIEXPO Russia 2017
International Paris Air Show 2017
Silicon Saxony Day 2017
MEMS Sensing & Network System 2017
MEMS Engineer Forum 2017
SEMICON Europa 2017
techtextil 2017
productronica 2017
COMPAMED 2017
Agritechnica 2017
European 3D Summit 2018
embedded world 2018
LOPEC 2018
SEMICON China 2018
Smart Systems Integration 2018
HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
SENSOR+TEST 2018
SEMICON West 2018
MEMS Sensing & Network System 2018
COMPAMED 2018
electronica 2018
SEMICON Europa 2018
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Intec 2019
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BioCHIP 2019
Paris Air Show 2019
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SEMICON West 2019
IMTC 2019
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MEMS Sensing & Network System 2020
mtex+ 2020
SENSOR+TEST 2020
MEMS Sensing & Network Systems 2021
MEF 2021
Fraunhofer Solution Days 2020
virtual.COMPAMED 2020
COMPAMED 2021
SEMICON Europa 2021
SENSOR+TEST 2021
LOPEC 2021
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Micro and Nanoelectronics
Processes and Technologies for Micro and Nanoelectronics
In situ plasma diagnostics for 7 nm etching processes
Characterization of Copper Alloys for Self-Forming Barrier Applications
New Characterization Opportunities for Surface Processing
Barrier and Metal Chemical Vapor Deposition (CVD) – UPDATE coming
Atomic Layer Deposition (ALD)
Technologies for Spintronics
Modeling and simulation of technological processes, equipment and devices
Simulation of devices
Simulation of processes and equipment
Modeling and simulation methods for efficient and full system characterization
Beyond CMOS and RF devices
Memristors for the computers of tomorrow
Functional Nano Structures for Biocomputing
RF MEMS Switch
Non-volatile, reconfigurable resistance switches
Technology development for analog high-frequency CNT-FETs
Technology Platform for Carbon Nanotube Devices
Resistive switching in ferroelectric, polycrystalline YMnO3 thin films
Demonstration on the Fabrication of Biocomputational Devices
Packaging and (heterogeneous) integration
Power Packaging – Silver and Copper/Tin Sintering for power Electronics
Tamper respondent envelope solutions realized by additive manufacturing – Smart Packaging Solutions for Secure Applications
HyperConnect: Self-assembly of micro and nanoparticles by centrifugal forces and capillary bridging for 3D thermal interconnects
Cool PoD: Printed 3D chip-2-board interconnects
Materials and Technologies to Enable High-Temperature Stable MEMS and Electronics
Electromagnetic and thermomechanic characterization and reliability evaluation
Thermo-mechanical reliability aspects of high temperature interconnects by transient liquid phase soldering
Multiscale residual stress analysis in thin film layers
High-precision deformation measurements in multi-scale applications – a verification methodology for simulation-based reliability predictions
Measurement of Intrinsic Stresses Using FIB Equipment Becomes a Method of Regular Industrial Practice
Long-term Reliability Testing Under Field Conditions and Evaluation of Acceleration Factors
Reliability optimization for the next generation of LED-based smart and comfortable lighting solutions
Systemic and long-term effects on the reliability of soldered joints for future mobility
Parameter identification by Nanoindenter
New Simulation Approach: Reliability Analysis applying CZM for 3D Packages
Combined experimental-numerical methods for thermo-mechanical system reliability
Reliability optimization of innovative design techniques of power electronic systems
New possibilities for lifetime testing
Automatized Measurement of Micromagnets on Wafer-Level in Close Distance
More informations are comming soon
Sensor and Actuator Systems
Inertial sensors
Intense2020 – Development of robust Acceleration sensors for automotive applications
High-Performance MEMS Gyroscope
Aluminum nitride – Innovative piezoelectric MEMS transducer
Direct integration of strain sensitive field effect transistors for NEMS
Piezoelectric low-power MEMS with aluminum nitride
KoliBriS – Modular technology platform for highly compact inertial sensors with integrated circuit electronics
Fluid Sensor
Gyrocompass
Aluminum nitride piezoelectric micromachined ultrasonic transducers
Optical systems/MOEMS
FABRY-PÉROT Interferometer for sensor applications in the infrared spectral range on their way to further miniaturization
MEMS components with subwavelength structures for infrared applications
Carbon nanotube (CNT) films as black body absorber or emitter for IR applications
Quantum Dot-based light emitting diodes on textiles
Fluorescence Spectroscopy
Platform for chip-integrated optical IR components
Electromagnetic sensors
Near Field Electromagnetic Sensors
Monolithically integrated 2D magnetic field sensors based on GMR spin valves
XMR Sensor Operating at MHz Sampling Rates
Spintronic Sensors for Magnetic Microbeads Detection
Spintronics: Laser Annealing for Local Crystallization of TMR Sensors
Pressure and power transducer
PMUT – A new generation of ultrasonic transducers
CNT based force sensors: Process Monitoring in forming tools
Material and structure sensors
Light-emitting Diodes based on Quantum Dots for Integration in plastic material
Mechanical load detection for lightweight materials
Metamaterials – Possibilities for the Realization of passive acting smart structures
Carbon nanotube giant piezoresistive strain sensors
Packaging and (heterogeneous) integration (2D, 2.5D, 3D)
Temporary wafer bonding for MEMS devices
Cu-TSV for MEMS based on a Via Last approach
Electro chemical deposition of integrated reactive Pd/Sn multilayer systems
Reliability
TSV Reliability
In Situ Stress Monitoring using a stress chip
UNSETH: Process and Reliability Assessments of Integration and Packaging Technologies Providing Hardware-based Security
Automated Virtual Prototyping of reconfigured FOWLP wafers
Thermo-mechanic excitation of encapsulated MEMS components
Virtual Prototyping for fast design of universal sensor platforms
On-line stress measurement during manufacturing and in field-testing with the stress chip
More informations are comming soon
Technologies and Systems for Smart Power and Mobility
Network Monitoring
Algorithms for the monitoring system ASTROSE® for increasing the current carrying capacity of overhead power lines
Partial discharge sensor using an immersed MEMS transducer
ISOSTROSE – Localization of ground faults on 110 kV o verhead powerlines with a wireless sensor system mounted at the conductor
Reliable thermo-mechanical design of high voltage planar technology solutions for smart wind power modules
Remote Ice Detection by Printed Resonator Arrays for Rotor Blades of Wind Power Plants
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
Autonomous sensor network for condition monitoring of high voltage power lines (ASTROSE)
Cable Joint Monitoring System
Energy supply of mobile devices
Transfer of Quantum Dot-sensitized solar cells onto technical textiles
Flexible, printed thin film batteries with increased discharge current
Improvement of aerodynamic conditions (vehicles and wind power plants)
Project: Clean Sky 2
Project: TOpWind
AFLoNext / CleanSky 2
Metamaterials – Possibilities for the Realization of passive acting smart structures
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
TOpWind – Improved wind harvesting capability by using active flow control
Reliability of power electronics/modules in electric cars
Active And passive thermal cycles for automotive applications
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
Project TRACE – Technology Readiness for Consumer Electronics Use in Automotive Applications
Profile optimization of Multilayer PCBs in Simulation and Deformation measurement
Optical in situ analysis of power electronic devices under power cycling conditions
»Design for Reliability« in Radio Frequency Electronics with alternative Interconnection Technologies for Future Smart Mobility
CosmoDU – Highly integrated industrial motor drive with self-learning capabilities
Canary structures based on SMD devices with reduced solder widths for PHM
Reliability Assessment and Optimization of a Smart Drive Unit
More informations are comming soon
Technologies and Systems for Smart Health
Implants
MAVO bioElektron
Theranostic Implants
WIRAplant: Wireless Active Implants
Medical Devices
Endostim
Project leiTEX: Printed energy storage for wireless evaluable sensor label
Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
VIAMOS – Vertically Integrated Array-type Mirau-based OCT System for early diagnostics of skin pathologies
Project Apfel
Measurement Technology and Analytics
Optical Systems
Microfluidics
Environment and agriculture
More informations are comming soon
Fraunhofer vs. Corona
M³Infekt
beforeFever
Technologies and Systems for Smart Production
Smart digital production
Digital Manufacturing in Mass Production – Functional Printing on 3D Objects
Thermo-mechanical reliability aspects of printed functionalities
Project: SAMPL
Printing technologies for the integration of electronic functionalities
Digital Roll-to-Product Manufacturing of Flexible Printed Smart Systems
Digital manufacturing in mass production
On-line monitoring of the micro welding process of Si parts in MEMS
Product customization in mass production – Printing of wiring harness segments on interior and exterior components
MAMA-MEA – Mass Manufacture of MEAs using high-speed deposition processes
DigiMan: Development of an R2R Printed and Hybrid Sensor System
»GoBeyond4.0«: Increase of Manufacturing Process Stability and Reliability of Printed Systems
Sensor Systems for Process and condition Monitoring
Wireless Sensor Systems
Novel Components
Artificial Intelligence
More informations are comming soon
More informations are comming soon_B
More information are comming soon.
Departments
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Multi Device Integration
Services
MEMS Design
Spectroscopy
RF MEMS Characterization
MEMS Analysis Service
Laser Micromachining
Micro Materials Center
More informations are comming soon.
Printed Functionalities
Nano Device Technologies
Research Fields
Processes and Materials
Interconnects for Micro and Nanoelectronics
3D Integration
Simulation of Devices, Processes and Equipment
Materials and Metallization for NEMS
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System Packaging
Department System Packaging - Research Fields
Wafer-to-Wafer Bonding
3D/MEMS Packaging
Biocompatible Packaging
Printing Technologies
MEMS applications
Characterization of bonding
Nanoimprint Lithography
Parylene based packaging
Electrochemical deposition of special materials
Department System Packaging - Services
Advanced System Engineering
Research Fields
Design of Electrical and Multi-Physical Systems
Wireless Sensor Systems
Wireless Energy Supply
Electromagnetic Near-Field Measurement Techniques
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Multi Device Integration
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Multi Device Integration
Services
We offer the following services:
MEMS/NEMS Design
Spectroscopy
RF-MEMS Characterization
MEMS Analysis Service
Picosecond Laser Micromachining
Fraunhofer Institute for Electronic Nano Systems