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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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Micro and Nanoelectronics
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Multi Device Integration
Main Focus of Research
Microfluidic Systemintegration
Sensor Integration
Optical Systems
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Parametertest
RF MEMS
Electronics Design
High Perfomance MEMS
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MEMS Design
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RF MEMS Characterization
MEMS Analysis Service
Laser Micromachining
Micro Materials Center
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Interconnects for Micro and Nanoelectronics
3D Integration
Simulation of Devices, Processes and Equipment
Materials and Metallization for NEMS
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Department System Packaging
Department System Packaging - Research Fields
Wafer-to-Wafer Bonding
3D/MEMS Packaging
Biocompatible Packaging
Printing Technologies
MEMS applications
Characterization of bonding
Electrochemical deposition of special materials
Nanoimprint Lithography
Parylene based packaging
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Advanced System Engineering
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Design of Electrical and Multi-Physical Systems
Wireless Sensor Systems
Wireless Energy Supply
Electromagnetic Near-Field Measurement Techniques
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2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-06-17_GoBeyond4.0
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3D & Systems Summit 2019
Intec 2019
LOPEC 2019
Smart Systems Integration 2019
BioCHIP 2019
Paris Air Show 2019
SENSOR+TEST 2019
SEMICON West 2019
IMTC 2019
MST-Kongress 2019
Agritechnica 2019
SEMCION Europa 2019
COMPAMED 2019
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Chemnitzer Seminare
32. Chemnitzer Seminar
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Workshop - Air Pulses without Pressurized Air
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Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
10 Years Fraunhofer ENAS
10 Years Fraunhofer ENAS - Registration
10 Years Fraunhofer ENAS without registration
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MEMS Sensing & Network System 2016
SEMICON Europa 2016
COMPAMED 2016
European 3D Summit 2017
Smart Systems Integration 2017
SEMICON China 2017
LOPEC 2017
HANNOVER Messe 2017
SENSOR+TEST 2017
SEMIEXPO Russia 2017
International Paris Air Show 2017
Silicon Saxony Day 2017
MEMS Sensing & Network System 2017
MEMS Engineer Forum 2017
SEMICON Europa 2017
techtextil 2017
productronica 2017
COMPAMED 2017
Agritechnica 2017
European 3D Summit 2018
embedded world 2018
LOPEC 2018
SEMICON China 2018
Smart Systems Integration 2018
HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
SENSOR+TEST 2018
SEMICON West 2018
MEMS Sensing & Network System 2018
COMPAMED 2018
electronica 2018
SEMICON Europa 2018
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Fraunhofer Institute for Electronic Nano Systems ENAS
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Multi Device Integration
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Multi Device Integration
Services
We offer the following services:
MEMS/NEMS Design
Spectroscopy
RF-MEMS Characterization
MEMS Analysis Service
Picosecond Laser Micromachining
Fraunhofer Institute for Electronic Nano Systems