Laser Micromachining

In research and development fast changing design steps of parts are very common, thus short processing times are needed. Laser micromachining is a powerful tool to process a wide range of materials and due to direct writing and processing of computer generated files new designs can be rapidly implemented. Especially picosecond pulse Laser machining is capable of delivering high precision with outstanding quality (small heat affected zone, no burr, …) at the same time for structuring a wide range of materials. It is thereby cost effective due to low initial costs (no masks are needed) and offers short processing times. At Fraunhofer ENAS the Laser workstation with an implemented Picosecond Laser with 4 different wavelengths (1064nm, 532nm, 355nm, 266nm) and a 1908nm continuous wave fiber laser, can not only be used as a prototyping tool, i.e. structuring and bonding of microfluidic parts, but can also be integrated in complex processing chains for example in MEMS/NEMS applications. Due to the wide range of variable parameters like Wavelength, Power, Pulse frequency, Mark speed, Focus-Spot-diameter etc., new processes can be developed and existing processes can be adapted to meet the customers need.

Application areas

  • Microfluidics
  • Dicing
  • Ceramic based applications
  • Counterfeit protection


  • Polymers
  • Glass
  • Metals
  • Semiconductors
  • Ceramics
  • Compounds


  • Cutting
  • Drilling
  • Bulk material ablation (also selective)
  • (Color-) Marking
  • Scribing
  • Welding
  • Surface treatment