Modeling and simulation of technological processes, equipment and devices

Simulation of processes and equipment

The simulation of technological processes in semiconductor industry (PVD, CVD, ALP, ECD) is a powerful tool to develop new and optimize established processes and equipment. By combining our own software tools with established fluid dynamic simulation methods and quantum chemistry, Fraunhofer ENAS is able to simulate and model processes starting from waferlevel, deposition in small structures up to surface chemistry.

Simulation of vapor deposion

Simulation of surface reactions

Atomistic process simulation

Application example: sputter processes

Application example: atomic layer processing

Application examples and scenarios

 

Simulation of silicon epitaxy for 22 nm FD-SOI technology within the project MOMENTUM

 

Multi scale simulation of atomic layer deposition

 

Process and equipment simulation of chemical vapor deposition

 

Simulation of pulsed electrochemical copper deposition in through silicon vias with high aspect ratio

 

Simulation of barrier/seed deposition for the metallization of 28 nm CMOS devices

 

Simulation of the dielectrophoretic deposition of carbon nanotubes

 

Reactor scale simulation of ALD processes

 

Parsivald - a new tool for the simulation of thin film growth

 

Experimental and theoretical inveatigations on a plasma assisted in situ restoration process for ULK dielectrics