The Sensors Expo & Conference 2013 takes place in Rosemont/USA on June 5 and 6, 2013. The Fraunhofer Institute for Electronic Nano Systems ENAS exhibits together with GEMAC mbH and Infra Tec GmbH Dresden at booth 917.

High-precision inertial sensors are shown, which were fabricated by using the AIM technology. This includes acceleration, inclination, vibration sensors and gyroscopes. In addition, a MEMS switch for the high frequency range is exhibited. The Fraunhofer ENAS also shows samples of low-temperature bonding processes for system integration as the reactive bonding and SLID bonding as well as thermal compression bonding for 3D integration. Moreover, the sensor network for condition monitoring of power lines is presented.