The Fraunhofer Institute for Electronic Nano Systems presents research results in micro and nano electronics and microsystems technologies, and its range of services at SEMICON Europe 2012 in Dresden / Germany from October 9 to 11, 2012. Additionally technologies for 3D integration, bonding and packaging equipment as well as process and equipment simulation are presented at booth 2.108 in hall 2.

This year, the Fraunhofer ENAS is also represented on the booth of the HTA SOI MEMS platform at booth 2.083. For instance, a probe card for the contactless measurement of MEMS elements is shown. Fraunhofer ENAS is here together with its partners VTT, CSEM, CEA LETI as part of the Heterogeneous Technology Alliance.

We are looking forward to welcome you at SEMICON Europe 2012.

 

Talks:

Tuesday October 9 2012

Session 3: Technology
10:10 - 10:30
"Low-temperature wafer bonding for Smart Systems Integration Processes"
Dr. Maik Wiemer (Department Manager System Packaging, Fraunhofer Institute for Electronic Nano Systems), Garden Hall, Messe Dresden

New Materials Session
12:25 - 12:40
"Atomic Layer Deposition Processes for integration ULSI Metallization Systems and Spintronic Sensor Devices"
Dr. Thomas Waechtler (Research Associate, Fraunhofer Institute for Electronic Nano Systems); TechArena 1, Messe Dresden


 
Wednesday October 10 2012

Workshop on Equipment Assessment & Equipment Performance Improvements
12:45 - 13:00
"Modeling and Simulation of Equipment and Processes for the Deposition of Thin Films"
Dr. Joerg Schuster (Senior Researcher, Fraunhofer Institute for Electronic Nano Systems); TechArena 2, Messe Dresden