Nano Device Technologies


We offer the following services:

  • Wafer processing
  • R&D service for processes and integration
  • Modeling and simulation of processes and equipment
  • Simulation of interconnect systems
  • Thin film measurement and characterization


On the special areas like:

  • Integration of low-k dielectrics
  • Diffusion barriers – Metallization
  • Air gap structures
  • Through-silicon vias (TSV) for 3D integration
  • CVD/ALD processes
  • CMP/Planarization
  • Spin-on dielectrics
  • Scaling effects in interconnects
  • Carbon Nanotubes for interconnects and sensors