Services
We offer the following services:
- Wafer processing
- R&D service for processes and integration
- Modeling and simulation of processes and equipment
- Simulation of interconnect systems
- Thin film measurement and characterization
On the special areas like:
- Integration of low-k dielectrics
- Diffusion barriers – Metallization
- Air gap structures
- Through-silicon vias (TSV) for 3D integration
- CVD/ALD processes
- CMP/Planarization
- Spin-on dielectrics
- Scaling effects in interconnects
- Carbon Nanotubes for interconnects and sensors