Fraunhofer Institute for Electronic Nano Systems
The SAB project “MIMODI-3D+ - Miniaturized modular digital 3D+ sensor system with optimized packaging for intelligent condition monitoring” can make a significant contribution to improve predictive condition and process monitoring in highly dynamic systems with new approaches in sensor technology, assembly and connection technology as well as data acquisition and processing.
The project partners AMAC, viimagic, the Center for Micro and Nano Technologies (ZfM) and Fraunhofer ENAS are collaborating in the development of a particularly small, thin, yet sensitive MEMS (≤ 400 μm) as a sensor element for a broadband (20 kHz) vibration sensor with significantly improved performance parameters compared to the state of the art.
One of the innovations of this project is a sensor element that enables the combined measurement of vibration (V) and shock (S) by combining different stiffnesses. The primary sensor system consists of the MEMS and a proprietary sensor ASIC developed by the project partner AMAC. This MSSC-ASIC is being completely redesigned for the project, with the design adapted to the characteristics of the new MEMS (MEMS-ASIC co-design), and manufactured using a particularly thin technology (≤ 360 μm). The new MEMS and the new ASIC will be stacked together in a miniaturized housing. This requires the development of an innovative package by our partner viimagic. The vibration sensor in the SMD housing in turn forms the basis for the single-axis 1D+ sensor module. The modular design consisting of optimized 1D+ sensors allows both single-axis and three-axis (combination of 3x 1D+ sensors) intelligent sensor modules to be constructed. AMAC also develops the hardware and firmware for the intelligent sensor module with digital data preprocessing in a microprocessor or, at a higher level, in an FPGA.
This project is supported by funds from the European Union and co-financed by tax revenues on the basis of the budget adopted by the Saxon State Parliament.