Fraunhofer Institute for Electronic Nano SystemsGrenoble, France - MINATEC Innovation Campus - / January 18, 2016 - January 20, 2016
European 3D TSV Summit 2016
Above and Beyond TSV
booth 8+9
Fraunhofer ENAS presents together with Fraunhofer IZM and Fraunhofer IKTS-MD the Fraunhofer-Cluster 3D Integration at the European 3D TSV Summit 2016 in Grenoble.
"Above and Beyond TSV" is the theme of the 4th European 3D TSV Summit, where cutting-edge technologies for 3D integration and miniaturized packaging are introduced.
Fraunhofer ENAS presents a range of 3D integration and wafer bonding technologies. The institute shows samples for SLID bonding, application of nano materials and wafer processing.