Grenoble, France - MINATEC Innovation Campus -  /  January 18, 2016  -  January 20, 2016

European 3D TSV Summit 2016

Above and Beyond TSV


Fraunhofer ENAS presents together with Fraunhofer IZM and Fraunhofer IKTS-MD the Fraunhofer-Cluster 3D Integration at the European 3D TSV Summit 2016 in Grenoble.

"Above and Beyond TSV" is the theme of the 4th European 3D TSV Summit, where cutting-edge technologies for 3D integration and miniaturized packaging are introduced.

Fraunhofer ENAS presents a range of 3D integration and wafer bonding technologies. The institute shows samples for SLID bonding, application of nano materials and wafer processing.