Grenoble/France  /  January 20, 2014  -  January 22, 2014

European 3D TSV Summit 2014

Booth 14

The theme of this year’s event is “Application Ready,” addressing 3D TSV from both a Business and Technology perspective. The latest TSV product developments and achievements will be addressed by executives and experts from global companies and European research institutions.    
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.

Fraunhofer ENAS presents the latest developments in the field of 3D integration. At the joint booth 14 the Fraunhofer IZM, the Fraunhofer ENAS and the Fraunhofer Cluster 3D-Integration will exhibit.