Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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      • Outstanding Paper Award of InterPACK 2020
      • 2023-07-27_FMD and Intel join forces to accelerate research
      • 2024-04-23_Best Paper Award SSI
      • 2024-05-30_One-Stop Store for Micromechanical Ultrasound
      • 2024-08-05_Start CCoE
      • Process modeling
      • Interview I Hiring of trainees
      • Interview Trust-E
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      • 20240918_PressRelease_TRC
      • Visit by Vietnamese delegation
      • reliability tests
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      • IHK Award
      • 20241124_PressRelease_Innovation Office Regensburg
      • 20241216_PressRelease_APECS
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      • 20250227_PressRelease_ThinSiCPower
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      • Parylene
      • Jochen Mueller
      • 20250526_Becamex
      • 2025-06-18_PressRelease_OpeningETRC
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        • 45th Chemnitz Seminar
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        • LABORATORY 2025
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      • Other Events
        • Archive: Other Events
        • 2023-07-05_Bruker Seminar/Workshop 2023
        • Vernissage: rēənˈvent / reinvent - Malerei Daniel Krüger
        • Colloquium "Digital Image and Volume Correlation"
        • Print heating pipes easily using the inkjet process
        • PESM 2025
        • Waferbond 2025
        • Science meets Art: Peter Piek
        • Green ICT Connect 2025
        • Green ICT Camp
        • Workshop MEMS Technologies & Applications
        • FIRSTbyFMD
    • Press Releases
      • 2017-06-28_Leti_and_Fraunhofer
      • 2017-07-05_EU Project EuroPAT-MASIP
      • 2017-08-30_COMPAMED2017_ProjectMIDARDI
      • 2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
      • 2018-03-14_For high-efficient computers using nanoscale biomolecules
      • 2018-04-10_ILA-BerlinAirShow2018
      • 2018-04-12_SSI2018_FinalReport
      • 2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
      • 2018-12-17_FraunhoferENAS_Research_Award_2018
      • 2018_12_17_Tohoku_University
      • 2018_12_17_Minapim_Brasilien
      • 2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
      • 2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
      • 2019-06-19_Al-Electroplating_SENSOR+TEST2019
      • 2019-06-20_Near-field-measurment_Sensor+Test2019
      • 2019-06-21_AlN-Technology_SENSOR+TEST2019
      • 2019-09-17_GoBeyond4.0
      • 2019-11-07_Memristor Whitepaper
      • 2020-11-05_Project_M3Infekt_FraunhoferENAS
      • 2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
      • 2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
      • 2021-03-22 Fraunhofer ENAS at LOPEC 2021
      • 2021_04_30_Smart Systems Integration
      • 2021-05-03 SENSOR+TEST 2021
      • 2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
      • 2021-06-10 Best Paper Award SSI2021
      • 2021-06-04 Press release TKOS FMD
      • 2021-07-01 Press release Miniature spectrometer for the smartphone
      • 2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
      • 2022-01-28_Inductive-Bonding
      • 2022-03-01_InkjetPrinting_LOPEC2022
      • 2022-04-07_Continuation of the Micro/Nano Performance Center
      • 2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
      • 2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
      • 2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
      • 2022-10-13_Recyclable food packaging: quality control for nanocoatings
      • 2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
      • 2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
      • 2023-07-27_FMD and Intel join forces to accelerate research
      • 2024-05-30_One-Stop Store for Micromechanical Ultrasound
      • 2024-08-05_Start CCoE
    • Trade Fairs
      • hy-fcell 2023
      • MST-Kongress 2023
      • COMPAMED 2023
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      • Nano Tech / MEMS Sensing and Network System
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      • Hannover Messe 2024
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        • Workshop - Air Pulses without Pressurized Air
    • Events
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      • Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
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    • Archives
      • MEMS Sensing & Network System 2016
      • SEMICON Europa 2016
      • COMPAMED 2016
      • European 3D Summit 2017
      • Smart Systems Integration 2017
      • SEMICON China 2017
      • LOPEC 2017
      • HANNOVER Messe 2017
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      • SEMIEXPO Russia 2017
      • International Paris Air Show 2017
      • Silicon Saxony Day 2017
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      • MEMS Engineer Forum 2017
      • SEMICON Europa 2017
      • techtextil 2017
      • productronica 2017
      • COMPAMED 2017
      • Agritechnica 2017
      • European 3D Summit 2018
      • embedded world 2018
      • LOPEC 2018
      • SEMICON China 2018
      • Smart Systems Integration 2018
      • HANNOVER MESSE 2018
      • ILA - Berlin Air Show 2018
      • SENSOR+TEST 2018
      • SEMICON West 2018
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      • COMPAMED 2018
      • electronica 2018
      • SEMICON Europa 2018
      • 3D & Systems Summit 2019
      • Intec 2019
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      • BioCHIP 2019
      • Paris Air Show 2019
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      • HANNOVER MESSE 2022
      • FC³ Fuel Cell Conference Chemnitz
      • techtextil 2022
      • ILA Berlin Air Show 2022
      • Farnborough International Airshow 2022
      • COMPAMED 2022
      • SEMICON Europa 2022
      • MEMS Sensing & Network System 2023
      • LOPEC 2023
      • intec 2023
      • SSI 2023
      • HANNOVER MESSE 2023
      • SENSOR+TEST 2023
      • LASER World of PHOTONICS 2023
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    • Management of the Institute
      • Dr. Stefanie Zimmermann
      • Prof. Dr. Harald Kuhn
      • Prof. Dr. Harald Kuhn
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        • Dr. Jochen Müller
        • Dr. Jörg Schuster
        • Dr. Danny Reuter
        • Prof. Dr. Karla Hiller
        • Dr. Maik Wiemer
        • Dr. Sascha_Hermann
        • Birgit Weber
        • Mareen Bunar
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        • Dr. Roman Forke
        • Andreas Morschhauser
        • Dr. Jörg Martin
        • Dr. Christan Hedayat
        • Dr. Alexander Weiß
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        • Dr. Mario Baum
        • Prof. Dr. Ralf Zichner
        • Annika Göhring
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        • Dr. Mario Braun
        • Alissa Hölzl
        • Dr. Diana Maier
        • Harald Kuhn
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        • "Reliability"
        • Stefanie Glöckner
    • European Test and Reliability Center
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      • Dr. Steffen Kurth
      • Dr. Christian Irmscher
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      • Heiko Maier
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      • Thomas Ronneburger
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        • Lithography for MEMS, NEMS and Nanodevices
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      • 3D/MEMS Packaging
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      • Inertial Components and Systems
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        • High Precision MEMS Angular Rate Sensor
      • Optical Components and Systems
        • Spectral Components
        • Sensor and Imaging Systems
        • Service: Material and Surface Characterization
      • Hybrid and Wireless Sensors and Systems
        • Wireless multi-sensor systems
        • Wireless Power Transfer
        • Hybrid Sensors and Actuators
      • RF Components and Systems
        • RF MEMS Switch
        • RF MEMS characterization
      • Acoustic Components
        • CMUT - Capacitive Micromechanical Ultrasonic Transducer
        • PMUT – A new generation of ultrasonic transducers
      • Printed Functionalities
        • Printed, flexible and hybrid electronics
        • Roll-to-roll printing machines, sheet format and printing on 3D objects
        • Printed Catalyst Coated Membrane (CCM) / MEA for their application in fuel cells and electrolyzers
      • Medical Systems and Smart Health
        • Microfluidic for Lab-on-Chip Systems
        • Theranostic Implants
        • Endostim
        • Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
        • Project Apfel
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      • Data-based Methods
        • Acceleration through AI
        • Sensor-based data fusion
        • Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
        • Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
        • AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
        • Implementation of a Novel Magnetic Field-Based Location Method Using AI
        • AI-based Image Analysis
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    Fraunhofer Institute for Electronic Nano Systems - 3D & Systems Summit

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    Date: 3.6.2026 05:55