Reliability of power electronics/modules in electric cars

»Design for Reliability« in radio frequency electronics with alternative interconnection technologies for future smart mobility

Fig. 1: Comparison of different solder ball variants for package contacting.
© Fraunhofer ENAS
Fig. 1: Comparison of different solder ball variants for package contacting.
Fig. 2: Investigation of potential package setups not yet used for radar.
© Fraunhofer ENAS
Fig. 2: Investigation of potential package setups not yet used for radar.

High-frequency electronics in the form of radar sensors are a central component of future mobility strategies. Within the BMBF-project radar4FAD concepts for universal radar modules for fully automated driving were developed. Fraunhofer ENAS dealt with the heterogeneous module integration for the realization of small, light and large series production-suited designs. Questions concerning the thermo-mechanical robustness of radar components in the to be developed radar module construction kit were solved. Potential package structures and their contacting, which are not yet used for radar applications, were investigated. The failure modes were analyzed and the reliable functionality was examined and optimized by means of experimental and theoretical methods. For this purpose »Physics of Failure«-based models for reliability prediction and optimization were developed. The predictions were made by means of numerical simulation. These models were calibrated on the basis of existing packages and applied to potentially usable packages. By means of this strategy of »virtual prototyping«, the goal of »first time right« should be secured during the project planning and design phase of the radar components.