Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
© Fraunhofer Mikroelektronik

© Fraunhofer Mikroelektronik

Technological Objectives and Core Areas of Expertise at Fraunhofer ENAS

APECS is aiming to enable a new generation of modular electronic systems. Instead of developing ever larger and increasingly complex system-on-chips, specialized chiplets are being combined via interposers and 3D stacks to create tailored systems. In the pilot line, standardized building blocks, design flows and test methods are being developed that enable the design, manufacturing and qualification phases of these complex modules to be completed at a faster pace. This shortens the innovation cycles when developing edge AI systems, optical high-speed connections and demanding sensor-actuator systems for industry and mobility.

 

Core technology fields at Fraunhofer ENAS

Within the APECS pilot line, Fraunhofer ENAS is deploying its expertise in the three core technology fields of System Technology Co-Optimization (STCO), interposer and chiplet integration, and characterization, testing and reliability assessment to make significant contributions to achieving the objectives. 

Design enablement and STCO

Fraunhofer ENAS is developing specific methods for System Technology Co-Optimization (STCO), particularly for 2.5D/3D heterogeneous integration.

Interposer and chiplet integration and advanced packaging

Fraunhofer ENAS is working on solutions for ultra-high density and post-CMOS interposers, for passive and organic interposers, and for 3D stacking and the functionalization of chiplets.

The development of wafer and chip bonding technologies, including surface pretreatment and digital twins supports this work.

Testing and reliability

Fraunhofer ENAS is building up a broad spectrum of characterization and test methods, including 2.5D/3D tests, optical tests and ESD/EMC investigations. Thermomechanical reliability analyses and state-of-the-art reliability modeling underpin the results.

This work is supplemented by various technology highlights:

  • Wafer-to-wafer bonding
  • Technologies for flexible interposers based on Parylene
  • Electrochemical depositing of aluminum
  • E-beam lithography
  • Digital twins to optimize manufacturing steps and process parameters
  • Micro-computed tomography
  • Wafer-level testing of photonic components