Micro Materials Center (MMC)

The field the MMC is working on is microreliability and nanoreliability. The combination of advanced numerical simulation with various experimental methods on different scale levels is the main characteristics of the department's activities.

The main objectives are:

  • Reliability of micro and nano components and microsystems

  • Thermomechanical simulation of micro components in high tech systems

  • Micro and nano deformation measurement techniques

  • MEMS/NEMS testing


Internationally recognized results have been obtained in the following fields:

  • Reliability of automotive electronics (solder joints, sensors
  • Quality assurance and life-time estimation of microsystems
  • Stress evaluation of packaging assemblies
  • Evaluation of thermal "misfit" problems in solder regions
  • Crack and fracture avoidance and evaluation in microelectronics applications
  • Reliability-centered design optimization (e.g. based on Design of Experience)

New fields of research are automotive electronics, high temperature electronics and micro mechatronics in miniaturized high tech systems. Recently, the so-called “micro and nano security” has become a new topic of the MMC. The DAC-techniques (Deformation Analysis by means of Correlation methods) have been successfully applied and qualified for quantitative micro deformation analysis. The microDAC and nanoDAC methods allow the accurate in-situ measurement of deformation fields within critical regions. For these results, the MMCB was awarded the Joseph-von-Fraunhofer prize by the Fraunhofer Society in 2005.