Virtual Prototyping for fast design of universal sensor platforms

© Fraunhofer ENAS
Finite element model of the UseP module with sensor assembly.
© Fraunhofer ENAS
Out-of-plane displacement at -40°C after 3 temperature cycles.
Loading profile for thermomechanical analysis.

The advantages of virtual prototyping ensure that the process has a significant place in product development. For example, digital prototypes usually cost less than physical prototypes. The costs for 3D CAD systems and simulation programs have decreased in recent years, but they are still considerable for small and medium-sized enterprises. Through the SAB-funded USeP project, SMEs are given access to electronic solutions through innovative system architectures and manufacturing methods that allow them to remain competitive in the IoT market. The reliability of the assembly and connection technology is of central importance in the implementation of the desired design variations of the overall system configured by means of a modular system. The application of a »bottom-up« method enables reliability assessments to be made sequentially with increasing system complexity. The virtual prototyping method was used to ensure the thermal and thermomechanical reliability of the universal sensor platform. Based on parametric finite element models, the desired variations could be ensured through the modular approach. All levels of packaging components are integrated in a combined set of models which enable the system to react quickly to model changes, towards further current and future SiP products based on FOWLP. The simulation schemes developed in the USeP project will enable SMEs to take advantage of virtual prototyping.