Fraunhofer Institute for Electronic Nano SystemsZurich/Switzerland / March 21, 2012 - March 22, 2012
Smart Systems Integration 2012
International Conference and Exhibition on Integration Issues of Miniaturized Systems
The 6th Smart Systems Integration Conference and Exhibition take place March 21st and 22nd 2012 in World Trade Center in Zurich. The chairman of the conference Prof. Dr. Thomas Gessner will explain the three generations of smart systems and actual best practice examples in his welcome presentation.
First time the Smart Systems Integration 2012 will be held in collaboration with MEMS Executive Congress Europe, organized by MEMS Industry Group.
Special sessions at the SSI 2012 are:
- EPoSS session - New approaches in Smart Systems Research
- EPoSS session - Policy perspectives for Smart Systems Integration
- US MEMS Session organized by MEMS Industry Group
- Smart Systems Integration in US organized by Roger Grace Associates
Scientists of Fraunhofer ENAS and the Center for Microtechnologies of the Chemnitz University of Technology show actual results in the following oral and poster presentations.
lectures:
Dr. Danny Reuter, Fraunhofer ENAS
Topic: Out of Plane Capacitive Trancducer in Air Gap Insulation Microstructures Technology for High Precicion Monolithic 3—Axis Sensors
March 21 2012, 01.55pm
Emerginig micro and nano devices and technologies
Prof. Dr. Bernd Michel, Fraunhofer ENAS
Topic: Advanced Reliability Testing of Smart Systems under Complex Loading
March 21 2012, 04.55pm
Test and reliability of components and systems
Jan Besser, Fraunhofer ENAS
Topic: Thermal and UV nanoimprint lithography for applications from the micro to the nano scale
March 21 2012, 05.20pm
New materials, nano structures and devices
Tom Enderlein, TU Chemnitz
Topic: Laser Micromachining and micro hot embossing for highly integrated Lab-on-Chip Systems
March 22 2012, 12.05pm
Manufacturing technologies
Dirk Wünsch, TU Chemnitz
Topic: 3D Integration for MEMS devices using photosensitive glass
March 22 2012, 03.45pm
Assembling and interconnect technologies
Dr. Sven Rzepka, Fraunhofer ENAS
Topic: Novel Architecture for Battery Management Systems in Fully Electrical Cars
March 22 2012, 03.55pm
Smart systems for automotive, green cars and aeroautics
Poster:
Jörg Bräuer, Fraunofer ENAS
Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials
Christian Gebauer, TU Chemnitz
Desing and Manufacturing of Micro Synthetic Jet Actuators
Prof. Dr. Ulrich Hilleringmann, Universität Paderborn
Electronic Device Integration on Foils Using Semiconductor Nanoparticles
Dr. Chenping Jia, TU Chemnitz
On the Wafer-Level Assembly of Multi-Component MOEMS Devices
Andreas Morschhauser, Fraunhofer ENAS
Towards integration of silica membrane based DNA extraction on chip
Petra Streit, TU Chemnitz
Comparison of lumped and finite element modeling for thermoelectric devices
Sven Voigt, TU Chemnitz
Autonomous sensor network for power line monitoring
Dr. Thomas Wächtler, Fraunofer ENAS
FIB/SEM Analysis for Smart Systems Integration