Fraunhofer ENAS presents the Fraunhofer Cluster 3D Integration together with Fraunhofer IZM, Fraunhofer IKTS-MD and Fraunhofer IIS-EAS at the European 3D TSV Summit 2015 in Grenoble, France.

The Fraunhofer ENAS shows 3D integration technologies and application for MEMS on the joint booth. The Fraunhofer researchers introduce a 3D interposer besides packaging technologies on wafer level like SLID bonding and eutectic bonding. First research results from the project HyperConnect are shown. Nanoparticle layers for thermal management of microchips in the package are investigated within this project. Also samples of nanoporous surfaces for energy storage are presented.