Fraunhofer Institute for Electronic Nano SystemsTokio/Japan / December 03, 2014 - December 05, 2014
SEMICON Japan 2014
Booth number: 1081-b
SEMICON Japan is the world's largest exposition of for machines, equipment and materials for semiconductor manufacturing. From December 3 to 5, 2014 the latest groundbreaking technologies are introduced to the most important representatives in key positions in the industry.
The Fraunhofer Institute for Electronic Nano Systems will be represented at booth 1081-b in the German pavilion.
The institute presents at the SEMICON Japan 2014:
- 3D integration technologies and applications
- Integration of Carbon Nanotubes and applications
- Low-temperature bonding
- Solid liquid interdiffusion bonding near room temperature for micro devices
- Aerosol-jet printing
presentation:
Jörg Frömel, Fraunhofer ENAS
Topic: "Packaging technologies for Smart Systems"
1:30 p.m. - 2:20 p.m.
Tech Spot West Hall 1