SEMICON China 2016

This year the Fraunhofer ENAS presents research results at the SEMICON China in Shanghai, too. The institute exhibits at the German Pavilion in hall N2 on booth 2571_3.

A selection of projects of System Packaging is introduced to the visitors. Samples concerning the following topics are shown:

Technologies for micro systems operating in high-temperature environments
Aerosol-jet printing
Technologies for 3D integration
Wafer bonding technologies among others for components of medical engineering

Fraunhofer ENAS presents the following topics at the China Semiconductor Technology International Conference (CSTIC) 2016 in Shanghai International Convention Center:

Sunday, March 13, 2016, 3:45 - 4:15 p.m.
Materials and technologies to enable high-temperature stable MEMS and electronics for smart systems used in harsh environments
Dr. Wei-Shan Wang (Fraunhofer ENAS)
Session II: Novel MEMS Devices and Sensors I
Symposium X: Advances in MEMS and Sensor Technology

Monday, March 14, 2016, 1:25 - 1:45 p.m.
Miniaturized vortex-induced vibration energy harvester for low velocity air flow application
Dr. Quan Wen (Fraunhofer ENAS)
Session V: MEMS and Sensor Materials andn Processes
Symposium X: Advances in MEMS and Sensor Technology