Tokyo/Japan  /  January 30, 2013  -  February 01, 2013

nano tech 2013

Fraunhofer ENAS presents its latest results in applied research on smart systems at the nano tech 2013 held in Tokyo/Japan from Jan 30 to Feb 1, 2013. The institute exhibits at booth 6D-21 in hall 6.

The nano tech is the world's largest nanotech fair and offers the whole range of cutting edge technologies and products such as nano materials, ultrafine processing technology and evaluation and measurement.

Together with the Gessner Group of the WPI-AIMR in Sendai, Fraunhofer ENAS shows samples for low-temperature bonding for sensor fabrication, 3D Integration, nanoeffect-based sensors, integration of the magnetic-based metallic glass thin film to MEMS fabrication for micro-mirror application and nanoporous metals on anodically-bondable LTCC substrates for electrical connective packaging.

The institute exhibits:

  • Cu-Cu wafer bonded by thermo-compression bonding,
  • Wafer bonded by reactive multi nanolayers,
  • 3D AMR sensor based on a Si-bulk interposer for 3D integration,
  • Wafers with aerosol printed and screen printed structures,
  • Polymer tools for Nanoimprint Lithography,
  • Nanoeffect-based sensors like a high-sensitive humidity sensor based on nanocomposites,
  • Microfluidic cartridge for point-of-care diagnostics,
  • Micro sieves,
  • Printed antennas and batteries.

The Gessner group of the WPI-AIMR at the Tohoku University in Sendai shows:

  • Magnetic micro mirror,
  • a micro mirror system.

Also the Fraunhofer Project Center “NEMS/MEMS Devices and Manufacturing Technologies at Tohoku University” founded in 2012 is introduced with its topics

  • R&D for advanced fabrication technologies and new materials for smart systems,
  • Semiconductor waferbonding,
  • System integration technologies,
  • Technology transfer.

The Project Center in Sendai is led by Professor Masoyashi Esashi, Tohoku University, and Professor Thomas Gessner, Fraunhofer ENAS.


Oral presentation:
Thursday, Jan 31, 2013; 1:45 – 2:05 p.m.
“Low-temperature wafer bonding”
Joerg Froemel, research associate at the Fraunhofer ENAS
Seeds&Needs Seminar B “Applications of Nanotechnology in Electronics, Energy and Mobility" in hall 6