Hybrid Integration of LED on optics

32. Chemnitzer Seminar

We invite you to the

CHEMNITZER SEMINAR

»MEMS Technologies and Applications«

 

May 21-22, 2019

in the Fraunhofer Institute for Electronic Nano Systems ENAS.

Program

Tuesday, May 21, 2019

12:30 - 12:40 Uhr pm Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
12:40 - 1:10 Uhr pm

Keynote: Trends and Challenges in MEMS Integration
Amandine Pizzagalli, Yole Développement

1:10 - 1:40 Uhr pm MEMS based Photo-Acoustic Gas Sensor
Dr. Rainer Schaller, InfineonTechnologies AG
1:40 - 2:10 Uhr pm Organic and Flexible Sensors in Applications
Dr. Dominik Gronarz, Organic Electronics Saxony Management GmbH
2:10 - 2:50 Uhr pm Poster and Demonstrator Presentation, Coffee Break and Networking
2:50 - 3:20 Uhr pm Keynote: Quality and Reliability Testing of Wirebonds – Limitations and  new Opportunities
Stefan Schmitz, Bond-IQ GmbH
3:20 - 3:50 Uhr pm Advanced Surface Micromachining Process – a First Step towards 3D MEMS
Dr. Jörg Bräuer, Robert Bosch GmbH
3:50 - 4:20 Uhr pm Capacitive Micromachined Ultrasonic Transducers for Medical and Non- Medical Applications
Dr. Nooshin Saeidi, Fraunhofer ENAS
4:20 - 4:50 Uhr pm Transferring Research Knowledge to Clinical Practice – Challenges and Chances
Dr. Marcus Binner, TissueGUARDTeam

Wednesday, May 22, 2019

8:30 -  8:40 Uhr am Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
8:40 -  9:10 Uhr am

Keynote: From Sampling to Ramping – Technology and Business Model Challenges for MEMS Foundries to Address WLP Applications
Stefan Ernst, X-FAB Semiconductor Foundries AG 

9:10 - 9:40 Uhr am USeP: Universal sensor platform  for IoT applications
Marco Meinig, Fraunhofer ENAS
9:40 - 10:10 Uhr am Electrodeposition of Aluminum Towards Wafer-Level Al-Al Thermocompression Bonding
Silvia Hertel, Fraunhofer ENAS
10:10 - 10:40 Uhr am Poster and Demonstrator Presentation, Coffee Break and Networking
10:40 - 11:10 Uhr am Current Funding Opportunities in Electronics and MEMS
Dr. Gregor Schwartz, VDI/VDE Innovation + Technik GmbH
11:10 - 11:40 Uhr am 3D Printed Electronics for Mechatronic Systems
Dr. Martin Hedges, Neotech AMT GmbH
11:40 - 12:10 Uhr pm Building-in Reliability into Power Modules
Dr. Jacek Rudzki, Danfoss Silicon Power GmbH
12:10 - 12:40 Uhr pm Discussion and end of workshop
12:40 - 2:00 Uhr pm Lunch
from 2:00 Uhr pm Individual Lab and Window Tours
© Fraunhofer ENAS
Dr. Maik Wiemer, head of department System Packaging at Fraunhofer ENAS, welcomes the numerous guests of the 32nd Chemnitzer Seminar.
© Fraunhofer ENAS
On the first day, the Keynote was hold by Amandine Pizzagalli of Yole Développement. She introduced trends and challenges in MEMS integration.
© Fraunhofer ENAS
The breaks offered opportunities to visit the poster session or maintain contact with specialist colleagues.
© Fraunhofer ENAS
Companies such as PacTech introduced themself during the event.
© Fraunhofer ENAS
Also Fraunhofer ENAS presented its reseaches as in the talk of Silvia Hertel on electrodeposition of aluminum towards wafer level Al-Al thermocompression bonding.
© Fraunhofer ENAS
Fraunhofer ENAS thanks all speakers for their contributions to a successful 32nd Chemnitzer Seminar.

Registration

The registration is free of charge.

Please send an e-mail for registration with the information whether you would like to attend both days or only one (May 21 or 22) to chemnitzer.seminare@enas.fraunhofer.de.

 

 

How to reach us

Hotel

Until April 16, rooms in Hotel Chemnitzer Hof can be ordered by using the keyword »Seminar System Packaging« or using the reservation from (pdf file) single room (incl. breakfast): 69 EUR.

Hotel Chemnitzer Hof, Theaterplatz 4, 09111 Chemnitz

phone: +49 371 684-0
email: info@chemnitzer-hof.de