Chemnitz Seminar  /  June 13, 2023  -  June 14, 2023

Electronic Packaging and Applications

With the 37th Chemnitz Seminar on "Electronic Packaging and Applications" the department System Packaging at Fraunhofer ENAS continues the series of Chemnitz Seminars. At our two-day workshop we discuss with representatives of industry and science current topics around the topic of electronics packaging and integration. This year, the focus will be on contributions on wafer bonding, integration technologies, novel materials, additive manufacturing processes and equipment in addition to insights into device developments in microsystems technology.
Special highlights besides the presentations will be a lab tour, networking breaks and a poster exhibition of current focal points of the Fraunhofer ENAS team.