Workshop  /  June 05, 2024  -  June 06, 2024

Electronic Packaging and Applications

The 39th Chemnitz Seminar will take place this time under the title "Electronic Packaging and Applications". During our two-day workshop, we will discuss current topics related to packaging and integration with representatives from industry and academia. This year, contributions on joining and integration technologies, novel materials, and additive manufacturing processes will be highlighted, along with insights into applications of microsystems technology.

Special highlights in addition to the presentations will include a laboratory tour, networking breaks, and a poster exhibition showcasing current focal points of the Fraunhofer ENAS team. We look forward to seeing you!