Hamburg, Germany  /  April 16, 2024  -  April 18, 2024

Smart Systems Integration 2024

to the conference website

Level 1 / Booth 5

Our exhibits

We present our research and development results on the following topics in Hamburg:

- Near-field scanners for electromagnetic investigations
- CMUT for underwater applications
- Plastic microneedles integrated into a sensor patch with micropump and lactate sensor
- Hydrogen sensors for measuring high hydrogen concentrations
- Parylene for medical applications and ultra-thin, highly flexible PCBs and as a substrate for plasma dicing
- Plasmactivated bonding

Oral presentations

SSI 2024

Wednesday, April 17, 2024
11:50 – 12:10 a.m.
Track 1: MEMS and Micro fluidics
Hollow microneedle fabrication and characterization for interstitial fluid extraction in minimally invasive sensors
(Best Paper 2023)
Tom Enderlein
Fraunhofer ENAS and Center for Microtechnologies, Chemnitz University of Technology

Wednesday, April 17, 2024
1:50 – 2:10  p.m.
Track 3 – Medical, health and automotive application of smart systems
Investigation of the Biocompatibility of Parylene-based Encapsulations for Medical Implants
Franz Selbmann
Fraunhofer ENAS

Wednesday, April 17, 2024
4:20 – 4:40  p.m.
Track 2: Reliability and test of smart systems
High Precision Magnetic Field Measurement of Wafer-level Integrated Micromagnets using an Automated Nearfield Scanner
Dominik Schröder
Fraunhofer ENAS


apc|m 2024

Wednesday, April 17, 2024
10:30 – 12:30 a.m.
Session 2, Part 2
Virtual Metrology Model for Partially Labelled Data for Plasma Etching Process
Mudassir Ali Sayyed
Fraunhofer ENAS and Chemnitz University of Technology


Tuesday, April 16, 2024
4:00 – 5:45 p.m.

SSI 2024

Design and Modeling of Mesoscale Polymere Based Acoustic Lenses for Miniaturized Ultrasonic Transducers
Shaista Andleeb, Fraunhofer ENAS

Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and LiTaO3/SiO2
Dominic Richter, Fraunhofer ENAS and Chemnitz University of Technology

Preliminary Investigation of Using Perminex Resist for Low Temperature Adhesive Bonding
Karman Frances Raj George Maria Selvam, Fraunhofer ENAS

Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration
Tobias Jäckel, Fraunhofer ENAS and Chemnitz University of Technology

Object detection using Capacitive Micromachined Ultrasonic Transducers(CMUTs)
Meghana Vishwanatha, Fraunhofer ENAS

Evaluation of Thin Pd Layers for a Sensor System to Monitoring Anode-Side Hydrogen Concentration in a Fuel Cell
Christopher Bickmann, Center for Microtechnologies, Chemnitz University of Technology

Efficient Implementation of Threshold-Based VNG Demosaicing with Reduced Calculations
Yousef Alnasar, Fraunhofer ENAS

Enhancing Information Extraction in EMC Measurements through Artificial Intelligence
Marcus Stiemer and Sven Lange, Fraunhofer ENAS

apc|m 2024

2.3 Machine-Learning-based Classification of Via Defects in SEM-Images.
Abdelmalek Cherchari, Fraunhofer ENAS and Chemnitz University of Technology