Fraunhofer Institute for Electronic Nano Systems- Bonding by using internal heat source at room-temperature
- Bonding energy created by self-sustaining exothermic reactions
- Very fast (up to 30 m/s)
- No additional heating (single impulse)
- Very high heating and cooling rates
- Bonding of heterogeneous materials, e.g. silicon-metal, ceramic metal, possible
- High strength, high conductive bonds
- RoHS conform (Lead free)