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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-06-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
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MEMS Sensing & Network System 2020
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Workshop - Air Pulses without Pressurized Air
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MEMS Sensing & Network System 2016
SEMICON Europa 2016
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European 3D Summit 2017
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SEMICON China 2017
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SEMIEXPO Russia 2017
International Paris Air Show 2017
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MEMS Sensing & Network System 2017
MEMS Engineer Forum 2017
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techtextil 2017
productronica 2017
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European 3D Summit 2018
embedded world 2018
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SEMICON China 2018
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HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
SENSOR+TEST 2018
SEMICON West 2018
MEMS Sensing & Network System 2018
COMPAMED 2018
electronica 2018
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Fraunhofer Institute for Electronic Nano Systems ENAS
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Micro and Nanoelectronics
Processes and Technologies for Micro and Nanoelectronics
In situ plasma diagnostics for 7 nm etching processes
Chemical Vapor Deposition of Cobalt Oxides at Low Temperatures
Thermal ALD of metallic copper on cobalt for advanced interconnects
Investigation of ULK etching processes by using plasma diagnostic and correlation analytics
Experimental and theoretical investigations on a plasma assisted in situ restoration process for ULK dielectrics
Characterization of Copper Alloys for Self-Forming Barrier Applications
Modeling and simulation of technological processes, equipment and devices
Simulation of devices
Simulation of processes and equipment
Modeling and simulation methods for efficient and full system characterization
Beyond CMOS and RF devices
Memristors for the computers of tomorrow
Functional Nano Structures for Biocomputing
RF MEMS Switch
Non-volatile, reconfigurable resistance switches
Technology development for analog high-frequency CNT-FETs
Packaging and (heterogeneous) integration
Power Packaging – Silver and Copper/Tin Sintering for power Electronics
Tamper respondent envelope solutions realized by additive manufacturing – Smart Packaging Solutions for Secure Applications
HyperConnect: Self-assembly of micro and nanoparticles by centrifugal forces and capillary bridging for 3D thermal interconnects
Cool PoD: Printed 3D chip-2-board interconnects
Materials and Technologies to Enable High-Temperature Stable MEMS and Electronics
Electromagnetic and thermomechanic characterization and reliability evaluation
Thermo-mechanical reliability aspects of high temperature interconnects by transient liquid phase soldering
Multiscale residual stress analysis in thin film layers
High-precision deformation measurements in multi-scale applications – a verification methodology for simulation-based reliability predictions
Measurement of Intrinsic Stresses Using FIB Equipment Becomes a Method of Regular Industrial Practice
Long-term Reliability Testing Under Field Conditions and Evaluation of Acceleration Factors
Reliability optimization for the next generation of LED-based smart and comfortable lighting solutions
Systemic and long-term effects on the reliability of soldered joints for future mobility
Parameter identification by Nanoindenter
New Simulation Approach: Reliability Analysis applying CZM for 3D Packages
More informations are comming soon
Sensor and Actuator Systems
Inertial sensors
Intense2020 – Development of robust Acceleration sensors for automotive applications
High-Performance MEMS Gyroscope
Aluminum nitride – Innovative piezoelectric MEMS transducer
Cu-TSV for MEMS based on a Via Last approach
Temporary wafer bonding for MEMS devices
Direct integration of strain sensitive field effect transistors for NEMS
Piezoelectric low-power MEMS with aluminum nitride
Thermo-mechanic excitation of encapsulated MEMS components
Optical systems/MOEMS
FABRY-PÉROT Interferometer for sensor applications in the infrared spectral range on their way to further miniaturization
MEMS components with subwavelength structures for infrared applications
Carbon nanotube (CNT) films as black body absorber or emitter for IR applications
Electromagnetic sensors
Near Field Electromagnetic Sensors
Monolithically integrated 2D magnetic field sensors based on GMR spin valves
XMR Sensor Operating at MHz Sampling Rates
Pressure and power transducer
PMUT – A new generation of ultrasonic transducers
Material and structure sensors
Light-emitting Diodes based on Quantum Dots for Integration in plastic material
Mechanical load detection for lightweight materials
Metamaterials – Possibilities for the Realization of passive acting smart structures
Carbon nanotube giant piezoresistive strain sensors
Reliability
TSV Reliability
In Situ Stress Monitoring using a stress chip
UNSETH: Process and Reliability Assessments of Integration and Packaging Technologies Providing Hardware-based Security
More informations are comming soon
Technologies and Systems for Smart Power ans Mobility
Network Monitoring
Algorithms for the monitoring system ASTROSE® for increasing the current carrying capacity of overhead power lines
Partial discharge sensor using an immersed MEMS transducer
ISOSTROSE – Localization of ground faults on 110 kV o verhead powerlines with a wireless sensor system mounted at the conductor
Reliable thermo-mechanical design of high voltage planar technology solutions for smart wind power modules
Remote Ice Detection by Printed Resonator Arrays for Rotor Blades of Wind Power Plants
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
Autonomous sensor network for condition monitoring of high voltage power lines (ASTROSE)
Energy supply of mobile devices
Transfer of Quantum Dot-sensitized solar cells onto technical textiles
Flexible, printed thin film batteries with increased discharge current
Improvement of aerodynamic conditions (vehicles and wind power plants)
Project: Clean Sky 2
Project: TOpWind
AFLoNext / CleanSky 2
Metamaterials – Possibilities for the Realization of passive acting smart structures
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
Reliability of power electronics/modules in electric cars
Active And passive thermal cycles for automotive applications
‘Design for Reliability’ in Power Electronics with New Interconnection Technologies for Future Smart Mobility and Smart Energy Solutions
Reliability Assessment and Optimization of a Smart Drive Unit
Project TRACE – Technology Readiness for Consumer Electronics Use in Automotive Applications
Profile optimization of Multilayer PCBs in Simulation and Deformation measurement
More informations are comming soon
Technologies and Systems for Smart Health
Implants
MAVO bioElektron
Theranostic Implants
WIRAplant: Wireless Active Implants
Medical Devices
Endostim
Project leiTEX: Printed energy storage for wireless evaluable sensor label
Devices for NeuroControl and NeuroRehabilitation (DeNeCor)
VIAMOS – Vertically Integrated Array-type Mirau-based OCT System for early diagnostics of skin pathologies
Measurement Technology and Analytics
Piezoelectric micro sensors for Oct applications
Project: MOLOKO – Novel rapid tests for food quality and animal health
Project: MIDARDI – for a better treatment of diabetic foot ulcer
Mobile pathogen analysis for the reduction of broadband antibiotics
Sens-o-Spheres
Development of a mobile diagnostic platform for the use on self-contained, exploration rovers within harsh environments
Tunable band-pass filters for infrared light
Capillary microfluidic chip with integrated pump and valve actuator
More informations are comming soon
Technologies and Systems for Smart Production
Smart digital production
Digital Manufacturing in Mass Production – Functional Printing on 3D Objects
Thermo-mechanical reliability aspects of printed functionalities
Project: SAMPL
Printing technologies for the integration of electronic functionalities
Digital Roll-to-Product Manufacturing of Flexible Printed Smart Systems
Digital manufacturing in mass production
Sensor Systems for Process and condition Monitoring
Structure-integrated wireless sensor and actuator technology for manufacturing systems (SdSeMa)
Printed highly-sensitive composite humidity sensors
Implementation of zero-power sensors with sensory metamaterials for applications in lightweight structural engineering
Active Workpiece Carrier
Wireless sensor systems for flexible design of production processes
Functional Safety
Optical monitoring system for quality control of electroplating solutions
Wireless sensor system for measuring of adhesive temperatures
Wireless sensor system for structural health monitoring
Intelligent industrial drive and flexible manufacturing based on workpiece data and sensor information
Oxygen measurement by cavity-enhanced mm-wave spectroscopy
Printed antennas on cardboard boxes enabling identification of metal objects in supply chains
More informations are comming soon
More informations are comming soon_B
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Departments
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Departments
Multi Device Integration
Main Focus of Research
Microfluidic Systemintegration
Sensor Integration
Optical Systems
New Materials
Parametertest
RF MEMS
Electronics Design
High Perfomance MEMS
Services
MEMS Design
Spectroscopy
RF MEMS Characterization
MEMS Analysis Service
Laser Micromachining
Micro Materials Center
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Printed Functionalities
Nano Device Technologies
Research Fields
Processes and Materials
Interconnects for Micro and Nanoelectronics
3D Integration
Simulation of Devices, Processes and Equipment
Materials and Metallization for NEMS
Services
System Packaging
Department System Packaging - Research Fields
Wafer-to-Wafer Bonding
3D/MEMS Packaging
Biocompatible Packaging
Printing Technologies
MEMS applications
Characterization of bonding
Electrochemical deposition of special materials
Nanoimprint Lithography
Parylene based packaging
Department System Packaging - Services
Advanced System Engineering
Research Fields
Design of Electrical and Multi-Physical Systems
Wireless Sensor Systems
Wireless Energy Supply
Electromagnetic Near-Field Measurement Techniques
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Fraunhofer Institute for Electronic Nano Systems