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  • Technologie-Campus 3, 09126 Chemnitz, Germany / February 27, 2024 - February 28, 2024

    Processes and Technologies for Nano Devices

    The 38th Chemnitz Seminar will take place this time under the title "Processes and Technologies for Nano Devices". In this workshop, we would like to discuss current questions about industry, science, and applications on novel devices with you as experts from the micro and nanotechnology sector.

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  • Technologie-Campus 3, 09126 Chemnitz, Germany / June 05, 2024 - June 06, 2024

    Electronic Packaging and Applications

    © Fraunhofer ENAS

    The 39th Chemnitz Seminar will take place this time under the title "Electronic Packaging and Applications". In this workshop, we would like to discuss current questions about industry, science, and applications on novel devices with you as experts from the micro and nanotechnology sector.

    more info
  • Chemnitz / September 30, 2024 - October 01, 2024

    Colloquium "Digital Image and Volume Correlation"

    © Towfiqu Barbhuiya via Canva.com

    Would you like to learn how image and volume correlation can be used in material and component testing, in damage or deformation analysis, and for reliability analysis of electronic components and systems? Register today for the colloquium and secure your spot!

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  • Chemnitz / October 01, 2024

    Science meets Art

    The presentation 'reinvent' at Fraunhofer ENAS showcases artistic outcomes from research practice and material-based experiments. We look forward to welcoming you to the vernissage on Tuesday, October 1, 2024, at Fraunhofer ENAS.

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  • Chemnitz and online / December 03, 2024 - December 04, 2024

    Sensor Systems for One Health

    The 40th Chemnitz Seminar is held under the title "Sensor Systems for One Health." Over two days, we will discuss with representatives from industry and academia how technological systems can support the One Health approach. One Health considers the interconnected health of humans, animals, and the environment and includes work from various fields such as human and veterinary medicine, environmental and agricultural sciences, or even food technology. In all these areas, intelligent systems for analyzing pathogens, capturing vital data, or monitoring living conditions play a major role today and are essential for the rapid diagnosis of critical conditions.

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  • Heating pipes are already used in many areas today. The Fraunhofer ENAS is involved in manufacturing technology (the inkjet printing process). The goal is to be able to produce heating conductors in single quantities, customized and cost-efficiently. The inkjet printing process as well as the performance of the manufactured heating conductors and scalable surface heaters are presented. The reliability is also discussed through high temperature testing, repeatability, long-term stability, and flexibility. Finally, experiences in the production of heating conductors on three-dimensional surfaces using robot-guided inkjet printing, as well as the development of a new printed heating conductor system for applications in electric vehicles, are presented.

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  • TKP Garden City Sendai BLDG, 21st Floor / December 09, 2024 - December 10, 2024

    Micro/Nanotechnology, MedTec and Life Sciences: Shaping the Future

    We cordially invite you to the 15th Fraunhofer Symposium "Micro/Nanotechnology, MedTec and Life Sciences: Shaping the Future" on December 9 and 10, 2024, in Sendai, Japan. The accompanying program includes an exhibition, a dinner reception, and lab tours.

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  • Fraunhofer ENAS / April 02, 2025, 6 PM

    Peter Piek – Flugbahn

    © Peter Piek

    We continue the series "Science Meets Art" with the exhibition "Peter Piek – Flugbahn". We will open the exhibition on April 2, 2025, at 6 PM.

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  • Fraunhofer ENAS / May 13, 2025 - May 14, 2025

    Electronic Packaging and Applications

    © Fraunhofer ENAS

    The Chemnitz Seminar "Electronic Packaging and Applications" will take place on May 13 and 14, 2025, at Fraunhofer ENAS in Chemnitz. In our two-day workshop, we will discuss current topics related to packaging and integration with representatives from industry and academia. This year, contributions focusing on joining and integration technologies, novel materials, and process technologies, as well as insights into applications of microsystems technology, will be in the spotlight.

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