Trade fairs and exhibitions

Fraunhofer ENAS presents technologies and development examples at the joint booth of FMD at this year's MST Congress, which are presented in detail in the technical presentations and posters. Among them are process technologies for multilayer systems, assembly and interconnection technologies, sensor technology and optical components.

Tuesday, October 24, 2023, 4.40 - 5.00 pm | Session B3: Optische Komponenten (2)

Design and fabrication of a metalens for shaping the light of quantum dot based light emitting diodes

Toni D. Großmann, Martin Möbius (Chemnitz University of Technology, Germany); Susanne Hartmann (Fraunhofer ENAS, Germany); Christoph Robert Meinecke (Chemnitz University of Technology, Germany); Jörg Martin (Fraunhofer ENAS, Germany); Danny Reuter (Technische Universität Chemnitz, Germany); Harald Kuhn (Chemnitz University of Technology, Germany))

Wednesday, October 25, 2023, 1.30 - 1.50 pm | Session A5: Prozesstechnologien (1)

Modelling and process development of ceramic heat transfer layers for ignition of integrated reactive multilayer systems

Klaus Vogel, Sebastian Schermer (Fraunhofer ENAS, Germany); Christian Helke (Chemnitz University of Technology, Germany); Sven Zimmermann (Technische Universität Chemnitz, Germany); Danny Reuter (Fraunhofer Institut ENAS, Germany)

Wednesday, October 25, 2023, 3.50 - 4.10 pm | Session B6: Sensorik (2)

Technologien mit hohem Aspektverhältnis für Vibrationssensoren mit großer Bandbreite, hoher Empfindlichkeit und geringem Rauschen

Petra Streit (Fraunhofer Institut ENAS, Germany); Roman Forke (Fraunhofer ENAS, Germany); Karla Hiller (Chemnitz University of Technology, Germany); Uwe Schwarz (X-Fab GmbH, Germany); Roman Ziegenhardt (X-FAB MEMS Foundry GmbH, Germany); Sven Voigt (Fraunhofer ENAS, Germany); Sebastian Weidlich (University of Testing & Fraunhofer ENAS, Germany); Alexey Shaporin (Fraunhofer ENAS, Germany); Susann Hahn (TU Chemnitz, Germany); Matthias Küchler (FhG ENAS, Germany); Harald Kuhn (Fraunhofer ENAS, Germany)

Wednesday, October 25, 2023, 2.50 - 3.50 pm | Postersession 2

P2.16B: Optimization of the etching process for improved DNA immobilization on Parylene

Susanne Hartmann (Technical University of Chemnitz); Thomas Werner (Fraunhofer ENAS, Germany); Julia Hann (Technical University of Chemnitz, Germany); Christian Helke (Chemnitz University of Technology, Germany); Micha Haase (Fraunhofer ENAS, Germany); Christoph R. Meinecke (Technische Universität Chemnitz, Germany); Danny Reuter (Fraunhofer Institut ENAS, Germany)

Wednesday, October 25, 2023, 2.50 - 3.50 pm | Postersession 2

P2.4C: Structural Integration of Smart Sensors for the Industrial Internet of Things

Volkhard Beyer (Fraunhofer EAS, Germany); Dirk Mayer (Münchner Strasse 16 & Fraunhofer EAS - Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive, Germany); Frank Haiduk (Fraunhofer EAS, Germany); Marco Meinig, Stefan Wittemeier, Volker Geneiss (Fraunhofer ENAS, Germany); Philipp Meissner, Andreas Weder (Fraunhofer IPMS, Germany); Thomas Werner (Fraunhofer IZM-ASSID, Germany); Wolfgang Zorn (Fraunhofer Institute for Machine Tools and Forming Technology, Germany)

Wednesday, October 25, 2023, 1.10 - 1.30 pm | Session B5: Sensorik 1

Fully integrated back-biased 3D Hall sensor with wafer-level integrated permanent micromagnets

Björn Gojdka (Fraunhofer ISIT, Germany); Daniel Cichon, Markus Stahl-Offergeld (Fraunhofer IIS, Germany); Dominik Schröder (Fraunhofer ENAS, Germany); Niels Clausen, Florian Ziegler (Fraunhofer ISIT, Germany); Christian Hedayat (Fraunhofer ENAS, Germany); Hans-Peter Hohe (Fraunhofer IIS, Germany); Thomas Lisec (Fraunhofer ISIT, Germany)