Fraunhofer Institute for Electronic Nano SystemsWe invite you to the
CHEMNITZER SEMINAR
»MEMS Technologies and Applications«
May 21-22, 2019
in the Fraunhofer Institute for Electronic Nano Systems ENAS.
32. Chemnitzer Seminar
Program
Tuesday, May 21, 2019
| 12:30 - 12:40 Uhr pm | Welcome Dr. Maik Wiemer, Fraunhofer ENAS |
| 12:40 - 1:10 Uhr pm | Keynote: Trends and Challenges in MEMS Integration |
| 1:10 - 1:40 Uhr pm | MEMS based Photo-Acoustic Gas Sensor Dr. Rainer Schaller, InfineonTechnologies AG |
| 1:40 - 2:10 Uhr pm | Organic and Flexible Sensors in Applications Dr. Dominik Gronarz, Organic Electronics Saxony Management GmbH |
| 2:10 - 2:50 Uhr pm | Poster and Demonstrator Presentation, Coffee Break and Networking |
| 2:50 - 3:20 Uhr pm | Keynote: Quality and Reliability Testing of Wirebonds – Limitations and new Opportunities Stefan Schmitz, Bond-IQ GmbH |
| 3:20 - 3:50 Uhr pm | Advanced Surface Micromachining Process – a First Step towards 3D MEMS Dr. Jörg Bräuer, Robert Bosch GmbH |
| 3:50 - 4:20 Uhr pm | Capacitive Micromachined Ultrasonic Transducers for Medical and Non- Medical Applications Dr. Nooshin Saeidi, Fraunhofer ENAS |
| 4:20 - 4:50 Uhr pm | Transferring Research Knowledge to Clinical Practice – Challenges and Chances Dr. Marcus Binner, TissueGUARDTeam |
Wednesday, May 22, 2019
| 8:30 - 8:40 Uhr am | Welcome Dr. Maik Wiemer, Fraunhofer ENAS |
| 8:40 - 9:10 Uhr am | Keynote: From Sampling to Ramping – Technology and Business Model Challenges for MEMS Foundries to Address WLP Applications |
| 9:10 - 9:40 Uhr am | USeP: Universal sensor platform for IoT applications Marco Meinig, Fraunhofer ENAS |
| 9:40 - 10:10 Uhr am | Electrodeposition of Aluminum Towards Wafer-Level Al-Al Thermocompression Bonding Silvia Hertel, Fraunhofer ENAS |
| 10:10 - 10:40 Uhr am | Poster and Demonstrator Presentation, Coffee Break and Networking |
| 10:40 - 11:10 Uhr am | Current Funding Opportunities in Electronics and MEMS Dr. Gregor Schwartz, VDI/VDE Innovation + Technik GmbH |
| 11:10 - 11:40 Uhr am | 3D Printed Electronics for Mechatronic Systems Dr. Martin Hedges, Neotech AMT GmbH |
| 11:40 - 12:10 Uhr pm | Building-in Reliability into Power Modules Dr. Jacek Rudzki, Danfoss Silicon Power GmbH |
| 12:10 - 12:40 Uhr pm | Discussion and end of workshop |
| 12:40 - 2:00 Uhr pm | Lunch |
| from 2:00 Uhr pm | Individual Lab and Window Tours |
Dr. Maik Wiemer, head of department System Packaging at Fraunhofer ENAS, welcomes the numerous guests of the 32nd Chemnitzer Seminar.
On the first day, the Keynote was hold by Amandine Pizzagalli of Yole Développement. She introduced trends and challenges in MEMS integration.
The breaks offered opportunities to visit the poster session or maintain contact with specialist colleagues.
Companies such as PacTech introduced themself during the event.
Also Fraunhofer ENAS presented its reseaches as in the talk of Silvia Hertel on electrodeposition of aluminum towards wafer level Al-Al thermocompression bonding.
Fraunhofer ENAS thanks all speakers for their contributions to a successful 32nd Chemnitzer Seminar.
Registration
The registration is free of charge.
Please send an e-mail for registration with the information whether you would like to attend both days or only one (May 21 or 22) to chemnitzer.seminare@enas.fraunhofer.de.
How to reach us
Hotel
Until April 16, rooms in Hotel Chemnitzer Hof can be ordered by using the keyword »Seminar System Packaging« or using the reservation from (pdf file) single room (incl. breakfast): 69 EUR.
Hotel Chemnitzer Hof, Theaterplatz 4, 09111 Chemnitz
phone: +49 371 684-0
email: info@chemnitzer-hof.de