Onsite-Online Hybrid Exhibition
MEMS Sensing and Network Systems 2021
Fraunhofer ENAS only attends in online exhibition
Permanent wafer bonding techniques are used in microelectronics and micromechanics to join thin, polished wafers made of different materials together - with or without additional intermediate layers.
General requirements:
- Low temperatures (< 400 °C)
- Material compatibility
- Mechanical stability
- Most cases: hermetic sealing
- Minimized bonding frame width
Microsystems based on piezoelectric aluminum nitride (AlN) offers the advantage of a high miniaturization potential. The technical developments include AlN-based microscanners with integrated position sensors for one or two-dimensional deflection of laser beams for application in high-precision, endoscopic systems for medical technology.
An advanced, ultra-thin and highly flexible PCB of only 20 µm thickness.with multiple redistribution layers is presented. In the project Fraunhofer ENAS develops the flexible PCB of Parylene and MEMS with TSV.
The advantageous substrate properties are transparency, biocompatibility, and chemical stability to realize a versatile platform for flexible electronics.
Fraunhofer Institute for Electronic Nano Systems