Fraunhofer Institute for Electronic Nano Systems
Smart Systems Integration by using Micro and Nano Technologies
The Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz focuses on research and development in the field of smart systems integration by using micro and nano technologies.
Thereby, not only multi functionality but also the implementation of different devices consisting of different materials plays an important role. The integration of nano materials as well as printed functionalities causes new challenges and requires new approaches in terms of design, testability, reliability and security. The Fraunhofer ENAS is picking up these topics in the business units micro and nano systems, green and wireless systems and micro and nanoelectronics/back-end of line.
Best Paper of Conference award at International Wafer-Level Packaging Conference IWLPC 2015 in San Jose
Februar 10th, 2016
The paper „3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin MEMS Accelerometer Packages“ has won the most prestigious best paper of conference award for the 2015 IWLPC in San Jose, CA. Lutz Hofmann, Dr. Danny Reuter, Ina Schubert, Dirk Wünsch, Michael Rennau, Dr. Ramona Ecke, Klaus Vogel, Dr. Knut Gottfried, Professor Stefan Schulz and Professor Thomas Gessner are authors of this paper. The conference technical and general chairs and the technical committee co-chairs of from all technical tracks selected this paper based on technical merit, relevance, originality, and writing quality.