Fraunhofer Institute for Electronic Nano Systems

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration by using Micro and Nano Technologies

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies to tested prototypes.

Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner

The TU Chemnitz and the Fraunhofer ENAS invite to a Honorary Colloquium in Rememberance of Prof. Dr. Thomas Geßner on September 8, 2016.
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On 25 May 2016 the director of our Fraunhofer Institute for Electronic Nanosystems ENAS

Prof. Dr. Dr. Prof. h. c. mult. Thomas Geßner

suddenly and unexpectedly died at the age of 61 years.

Professor Geßner was at the same time full professor of the chair of Microtechnology of the Faculty of Electrical Engineering and Information Technology and director of the Center for Microtechnologies of the Technische Universität Chemnitz. Thanks to his active commitment, the Technikum Mikroelektronik founded in 1979 in cooperation between ZMD and the Technische Hochschule Karl-Marx-Stadt was re-established in 1991 as Center for Microtechnologies and additionally oriented towards microsystem technology.


Smart Systems Integration 2017 - Call for papers -

Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.

Submit your abstract for SSI 2017 now and benefit from the conference for your success.

Deadline: 5 October 2016

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Best Paper of Conference award at International Wafer-Level Packaging Conference IWLPC 2015 in San Jose


Februar 10th, 2016

The paper  „3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin MEMS Accelerometer Packages“ has won the most prestigious best paper of conference award for the 2015 IWLPC in San Jose, CA. Lutz Hofmann, Dr. Danny Reuter, Ina Schubert, Dirk Wünsch, Michael Rennau, Dr. Ramona Ecke, Klaus Vogel, Dr. Knut Gottfried, Professor Stefan Schulz and Professor Thomas Gessner are authors of this paper.  The conference technical and general chairs and the technical committee co-chairs of from all technical tracks selected this paper based on technical merit, relevance, originality, and writing quality.