Fraunhofer Institute for Electronic Nano Systems

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies up to tested prototypes.

Focus on

Cutting-Edge Technologies for Advanced, Ultra-Precise Ultrasound

Testing and reliability assessment of semiconductor innovations as a future driver of technological progress

A holistic approach to global health: How the well-being of people and nature keeps our world in balance

Setting off into a green future with the packaging of efficient electronic power modules

On the Path to Green Energy with Smart Technologies and Components

Quantum Leap in Technology - Shaping the Future

Events

 

Science meets Art: "Peter Piek – Flugbahn"

We continue the series "Science Meets Art" with the exhibition "Peter Piek – Flugbahn"

We will open the exhibition on April 2, 2025, at 6 PM.

 

42nd Chemnitz Seminar »Electronic Packaging and Applications«

We invite you to the Chemnitz Seminar on May 13 and 14, 2025. Discuss with representatives from industry and academia about issues related to packaging and integration.

 

Smart Systems Integration Conference 2025 - Program

The program for the SSI 2025 is online now!

 

Events

Information on trade fairs, conferences, events, workshops and lectures

 

Fraunhofer ENAS will be present at the following trade fairs in the first half of 2025:

Sensor+Test | May 6-8, 2025
PCIM | May 6-8, 2025

News

 

Parylene – an all-rounder: Ultra-thin polymer with protective properties

In this interview, Franz Selbmann explains what makes Parylene unique and what application potential the “talented” material offers.

 

Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany (FMD) officially unveiled its new Chiplet Application Hub

 

Faster, more powerful, more interconnected: KoVoPack project heralds a new era for mobile networks

The project develops a comprehensive technology platform that enables the efficient and cost-effective production of fully integrated electronic systems, known as "System-in-Package" (SiP) solutions.

 

Commitment to greater sustainability: Fraunhofer ENAS receives ISO 50001 certification

The certification confirms the institute's commitment to greater sustainability and the responsible use of resources. 

 

Thin Chips and Robust Substrates - Key Technologies for Cost-Efficient Silicon Carbide Power Electronics

"ThinSiCPower" is developing an alternative way to produce cost-effective SiC substrates and significantly thinner SiC chips.

 

Fraunhofer ENAS and equipment manufacturer ELES announce cooperation

Strategic partnership boosts new center of expertise for semiconductor testing

 

“Detective work”: Searching for traces of defective microtechnological structures

In this interview, Elke Noack explains how electronic components can be examined non-destructively with maximum precision.

 

Press and News

Current press releases and news from Fraunhofer ENAS

Cooperations

 

Cooperations within Fraunhofer

 

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