Fraunhofer Institute for Electronic Nano Systems

Fraunhofer ENAS - Your System and Technology Partner in the Field of Smart Systems Integration by using Micro and Nano Technologies

The particular strength of the Fraunhofer Institute for Electronic Nano Systems ENAS lies in the development of smart integrated systems for different applications. Fraunhofer ENAS develops single components, technologies for their manufacturing as well as system concepts and system integration technologies and transfers them into production. The institute offers research and development services from the idea, via design and technology development or realization based on established technologies to tested prototypes.


Smart Systems Integration 2017 - Call for papers -

Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.

Submit your abstract for SSI 2017 now and benefit from the conference for your success.

Deadline: October 26, 2016

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Best Paper of Conference award at International Wafer-Level Packaging Conference IWLPC 2015 in San Jose


February 10, 2016

The paper  „3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin MEMS Accelerometer Packages“ has won the most prestigious best paper of conference award for the 2015 IWLPC in San Jose, CA. Lutz Hofmann, Dr. Danny Reuter, Ina Schubert, Dirk Wünsch, Michael Rennau, Dr. Ramona Ecke, Klaus Vogel, Dr. Knut Gottfried, Professor Stefan Schulz and Professor Thomas Gessner are authors of this paper.  The conference technical and general chairs and the technical committee co-chairs of from all technical tracks selected this paper based on technical merit, relevance, originality, and writing quality.