Smart Systems Integration 2016

Fraunhofer ENAS represents toghether with Fraunhofer IZM and Fraunhofer IPMS the "High Performance Center for Functional Integration of Micro- and Nanoelectronics" at this year's Smart Systems Integration Conference. The conference and accompaning exhibition show various issuses on integration of miniaturized systems.

In Munich, the Fraunhofer ENAS exhibits joint development samples with the Center for Microtechnologies of TU Chemnitz on booth 33 from March 9 until 10, 2016.

We invite you to our booth with a free entry ticket. Please, register as visitor online smartsystemsintegration.com/tickets and fill in the registration number 1612301080.

Oral Presentations 2016:

Steffen Hartmann, TU Chemnitz
"A MEMS Test Stage for In Situ Testing of Interfaces Between Carbon Nanotubes and Metals" (nominated for Best Paper Award 2016)
Wed, March 9, 2016, 11 a.m.
Session: Test and reliability I

Christian Hangmann, Universität Paderborn
"Improved RF Design Using Precise 3D Near-Field Measurements and Near-Field to Far-Field Transfoermations"
Wed, March 9, 2016, 12:15 p.m.
Session: Test and reliability I

Franz Selbmann, Fraunhofer ENAS
"Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications"
Wed, March 9, 2016, 2:55 p.m.
Session: System integration and packaging II

Dr. Dietmar Vogel, Fraunhofer ENAS
"Instrinsic Stress Measurement by FIB Ion Milling Becomes an Industrial-Strength Method" (nominated for Best Paper Award 2016)
Wed, March 9, 2016, 2:05 p.m.
Session: Test and reliability II

Prof. Dr. Stefan E. Schulz, Fraunhofer ENAS
"High Performance Center Functional Integration in Micro and Nanoelectronics - Opportunities for SMEs in Product and Technology Development"
Wed, March 9, 2016, 4:45 p.m.
SME session

Maik-Julian Büker, Fraunhofer ENAS
"Efficient Design Methodology for Inductive Energy Transmission"
Thu, March 10, 2016, 11:45 a.m
Session: Design of smart integrated systems

Frank Roscher, Fraunhofer ENAS
"A New Approach for 3D Integration Based on Printed Multilayers and Through Polymer Vias"
Thu, March 10, 2016, 2:55 p.m.
Session: Security risks growing, which new EP&I technologies to face them

Dr. Eberhard Kaulfersch, Fraunhofer ENAS
"Reliability Assessment of PCB for Smart Secure Applications"
Thu, March 10, 2016, 3:45 p.m.
Session: Security risks growing, which new EP&I technologies to face them

Julia Wecker, Fraunhofer ENAS
"Oxygen Detection System Consisting of a Millimeter Wave Fabry-Pérot Resonator and an Integrated SiGe Front-End"
Thu, March 10, 2016, 3:20 p.m.
Session: Smart systems applications

Poster Presentations 2016:

Postersessions:
Wed, March 9, 2016, 3:20 - 4:20 p.m.
Thu, March 10, 2016, 1:30 - 2:30 p.m.

Dr. Ellen Auerswald, Fraunhofer ENAS
"Best Practice Approaches for Stress Measurements on Thin Layer Stacks"

Volker Geneiß, Fraunhofer ENAS
"Product Data and Sensor-Based Intelligent Drive Control for Flexible Manufacturing and Intralogistic Processes"

Sven Haas, TU Chemnitz
"Novel Through Silicon Wiring Technology Using Dry Etched Sloping Vertical Terminals"

Jörn Langenickel, TU Chemnitz
"Optimization of a Zinc Oxide Dispersion for building Quantum Dot Light Emitting Diodes"

Alexander Otto, Fraunhofer ENAS
"Reliability Assessment of a Smart and Compact Inverter Developed for Electrically Powered Construction Vehicles"

Dr. Andreas Willert, Fraunhofer ENAS
"Printed Batteries Designed to Power OLED Applications"