Low-temperature Bonding

Fraunhofer ENAS offers these technologies for low-temperature wafer bonding:

• Room-temperature bonding by using reactive nano scale multilayer
• Anodic bonding (glass/Si)
• Direct bonding (glass/glass; glass/Si; SiSi)
• Adhesive bonding (SU-8; BCB)
• Solid-liquid interdiffusion bonding (CuSn)
• Thermo-compression bonding