Fraunhofer ENAS investigates the integration of carbon nanotubes with wafer level techniques for electronic and sensor applications. Both ways are followed, the process development for growth and assembly of CNTs as well as the development of application specific fabrication technologies for CNT devices.
Different CNT applications are focused:
- Flexible electrical CNT interconnects for flip-chip applications
- CNTs as vertical interconnects for next generation interconnects in ULSI circuits
- Development and fabrication of nano test platform for characterization of nanomaterials
- CNT based electromechanical transducers with different working principles
- CNT transitors