Conference 2013

The 19th International Workshop on Thermal Investigations of ICs and Systems

will be held in Berlin, Germany, September 25 - 27.

Main topics of the conference

  • Thermal Phenomena
  • Thermal Management Concepts
  • Thermal Materials
  • Thermal Technologies
  • Thermal Design & Simulation
  • Thermal Measurement Techniques      


  • Nano-, Micro- & Power-Electronics
  • Solid-State Lighting
  • MEMS



Wednesday, Sep 25, 2013


Session 4: Thermal (Interface) Materials

Development and fabrication of thin film thermo test chips and its integration into a test system for thermal interface characterization

Mohamad Abo Ras1,2, Gunter Engelmann3, Ralph Schacht2,4, Daniel May5, Bernhard Wunderle2,5, Thomas Winkler1, Bernd Michel2

1Berliner Nanotest und Design GmbH, Germany; 2Fraunhofer Institute for Electronic Nano Systems ENAS, Germany; 3Fraunhofer Institute for Reliability and Microintegration IZM, Germany; 4University of Applied Sciences Lausitz, Germany; 5Chemnitz University of Technology, Germany


Poster Session & Cocktails

Parametric transient thermo-electrical PSPICE-Model for a power cable

Ralph Schacht1,2,3, Sven Rzepka2,3, Bernd Michel2,3

1Lausitz University of Applied Sciences, Germany; 2Fraunhofer ENAS, Germany; 3Joint Lab Berlin - Technical Safety, Germany


Poster Session & Cocktails

Combined Method for Thermal Characterization of High Power Semiconductors

Enrico Merten1, Mohamad Abo Ras1, Tobias von Essen1, Ralph Schacht2, Daniel May3, Thomas Winkler1, Bernd Michel4

1Berliner Nanotest & Design GmbH, Germany; 2Hochschule Lausitz (FH), Germany; 3Technische Universität Chemnitz, Germany; 4Fraunhofer ENAS, Germany


Thursday, Sep 26, 2013


Session 6: Thermal Metrology

Transient thermal techniques as failure analytical tool

Daniel May1, Bernhard Wunderler1, Ralph Schacht2, Bernd Michel3

1Technical University Chemnitz, Chemnitz, Germany; 2University of Applied Sciences Lausitz, Senftenberg, Germany; 3Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany

9:40am - 11:00am

Session 6: Thermal Metrology

Improving the Accuracy of Junction Temperature Measurement with the Square-root-t Method

Christian Herold1, Menia Beier1, Josef Lutz1, Alexander Hensler2

1Chemnitz University of Technology, Germany; 2SIEMENS AG, Erlangen


Session 7: Reliability

Stress Impact of Thermal-Mechanical Loads Measured with the Stress Chip

Florian Schindler-Saefkow1,2,4, Florian Rost1, Alexander Otto1,4, Jürgen Keller2, Thomas Winkler4, Bernhard Wunderle3,1, Bernd Michel1, Sven Rzepka1,4

1Fraunhofer ENAS, Germany; 2AMIC Angewandte Micro-Messtechnik GmbH; 3Technische Universität Chemnitz; 4Berliner Nanotest and Design GmbH

Friday, Sep 27, 2013

9:40am - 11:20am

SS 1: Smart Power

Double-Sided Cooling and Thermo-Electrical Management of Power Transients for Silicon Chips on DCB-Substrates for Converter Applications: Design, Technology and Test

Bernhard Wunderle1, Charles-Alix Manier2, Mohamad Abo Ras3, Martin Springborn1, Daniel May1, Hermann Oppermann2, Michael Toepper2, Raul Mrossko4, Tristan Caroff5, Wilhelm Maurer6, Radoslava Mitova7

1TU Chemnitz, Germany; 2Fraunhofer IZM, Germany; 3Nanotest GmbH, Germany; 4Amic GmbH, Germany; 5CEA, France; 6Infineon, Germany; 7Schneider Electric, France


SS 2: Nanotherm

Reliability of advanced thermal interface technologies based on sintered die-attach materials

Jens Heilmann1, Ivan Nikitin2, Daniel May1, Klaus Pressel2, Bernhard Wunderle1,3

1Technische Universität Chemnitz, Germany; 2Infineon Technologies, Regensburg, Germany; 3Fraunhofer ENAS, Chemnitz, Germany

Check out all the preliminary program:



  • Thomas Brunschwiler, IBM Research, Zurich, Advanced Thermal Packaging, Rüschlikon, Switzerland
  • Berthold Hellenthal , AUDI AG, Robust Design / Semiconductor Strategy/ Electronic Components Test, Ingolstadt, Germany
  • Theo Treurniet, Philips Lighting, LED Platform Development, Function Owner Thermal Management, The Netherlands


We are looking forward to seeing you in Berlin:

Peter Raad, South. Methodist U., USA (General Chair)

Marta Rencz, BME, Budapest, Hungary (Vice General Chair)

Bernhard Wunderle, Chemnitz U. of Technology, Chemnitz, Germany (Programme Chair)

Andras Poppe, BME, Budapest, Hungary (Vice Programme Chair)


The workshop is supported by  

  • Fraunhofer ENAS
  • Chemnitz University of Technology
  • Lausitz University of Applied Sciences
  • AMIC
  • CMP

Commercial sponsors are:

  • IBM
  • NXP
  • Thales
  • Mentor Graphics
  • Nanotest

For more information please visit: