Hybrid Integration of LED on optics

32. Chemnitzer Seminar

We invite you to the


»MEMS Technologies and Applications«


May 21-22, 2019

in the Fraunhofer Institute for Electronic Nano Systems ENAS.


Tuesday, May 21, 2019

12:30 - 12:40 Uhr pm Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
12:40 - 1:10 Uhr pm

Keynote: Trends and Challenges in MEMS Integration
Amandine Pizzagalli, Yole Développement

1:10 - 1:40 Uhr pm MEMS based Photo-Acoustic Gas Sensor
Dr. Rainer Schaller, InfineonTechnologies AG
1:40 - 2:10 Uhr pm Organic and Flexible Sensors in Applications
Dr. Dominik Gronarz, Organic Electronics Saxony Management GmbH
2:10 - 2:50 Uhr pm Poster and Demonstrator Presentation, Coffee Break and Networking
2:50 - 3:20 Uhr pm Keynote: Quality and Reliability Testing of Wirebonds – Limitations and  new Opportunities
Stefan Schmitz, Bond-IQ GmbH
3:20 - 3:50 Uhr pm Advanced Surface Micromachining Process – a First Step towards 3D MEMS
Dr. Jörg Bräuer, Robert Bosch GmbH
3:50 - 4:20 Uhr pm Capacitive Micromachined Ultrasonic Transducers for Medical and Non- Medical Applications
Dr. Nooshin Saeidi, Fraunhofer ENAS
4:20 - 4:50 Uhr pm Transferring Research Knowledge to Clinical Practice – Challenges and Chances
Dr. Marcus Binner, TissueGUARDTeam

Wednesday, May 22, 2019

8:30 -  8:40 Uhr am Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
8:40 -  9:10 Uhr am

Keynote: From Sampling to Ramping – Technology and Business Model Challenges for MEMS Foundries to Address WLP Applications
Stefan Ernst, X-FAB Semiconductor Foundries AG 

9:10 - 9:40 Uhr am Sensor Development for Space Applications – Challenges and Opportunities
Robin Schmidt, Jena- Optronik GmbH
9:40 - 10:10 Uhr am Electrodeposition of Aluminum Towards Wafer-Level Al- l Thermocompression Bonding
Silvia Hertel, Fraunhofer ENAS
10:10 - 10:40 Uhr am Poster and Demonstrator Presentation, Coffee Break and Networking
10:40 - 11:10 Uhr am Current Funding Opportunities in Electronics and MEMS
Dr. Gregor Schwartz, VDI/VDE Innovation + Technik GmbH
11:10 - 11:40 Uhr am 3D Printed Electronics for Mechatronic Systems
Dr. Martin Hedges, Neotech AMT GmbH
11:40 - 12:10 Uhr pm Building-in Reliability into Power Modules
Dr. Jacek Rudzki, Danfoss Silicon Power GmbH
12:10 - 12:40 Uhr pm Discussion and end of workshop
12:40 - 2:00 Uhr pm Lunch
from 2:00 Uhr pm Individual Lab and Window Tours


The registration is free of charge.

Please send an e-mail for registration with the information whether you would like to attend both days or only one (May 21 or 22) to chemnitzer.seminare@enas.fraunhofer.de.



How to reach us


Until April 16, rooms in Hotel Chemnitzer Hof can be ordered by using the keyword »Seminar System Packaging« or using the reservation from (pdf file) single room (incl. breakfast): 69 EUR.

Hotel Chemnitzer Hof, Theaterplatz 4, 09111 Chemnitz

phone: +49 371 684-0
email: info@chemnitzer-hof.de