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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-09-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
2020-11-05_Project_M3Infekt_FraunhoferENAS
2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
2021-03-22 Fraunhofer ENAS at LOPEC 2021
2021_04_30_Smart Systems Integration
2021-05-03 SENSOR+TEST 2021
2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
2021-06-10 Best Paper Award SSI2021
2021-06-04 Press release TKOS FMD
2021-07-01 Press release Miniature spectrometer for the smartphone
2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
2022-01-28_Inductive-Bonding
2022-03-01_InkjetPrinting_LOPEC2022
2022-04-07_Continuation of the Micro/Nano Performance Center
2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
2022-10-13_Recyclable food packaging: quality control for nanocoatings
2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
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MEMS Sensing & Network System 2023
LOPEC 2023
intec 2023
SSI 2023
HANNOVER MESSE 2023
SENSOR+TEST 2023
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Chemnitzer Seminare
32. Chemnitzer Seminar
36th Chemnitz Seminar
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Double Opt-in Confirmation
Confirmation of Registration for Chemnitz Seminars
37th Chemnitz Seminar
Workshops
Archiv Workshops
Workshop - Air Pulses without Pressurized Air
APPLAUSE Heterogeneous Integration Summer School
CMP and WET Users' Group Meeting 2022
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Honorary Colloquium in Remembrance of Prof. Dr. Thomas Geßner
10 Years Fraunhofer ENAS
10 Years Fraunhofer ENAS - Registration
10 Years Fraunhofer ENAS without registration
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Registration Fraunhofer ENAS Summer School
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MEMS Sensing & Network System 2016
SEMICON Europa 2016
COMPAMED 2016
European 3D Summit 2017
Smart Systems Integration 2017
SEMICON China 2017
LOPEC 2017
HANNOVER Messe 2017
SENSOR+TEST 2017
SEMIEXPO Russia 2017
International Paris Air Show 2017
Silicon Saxony Day 2017
MEMS Sensing & Network System 2017
MEMS Engineer Forum 2017
SEMICON Europa 2017
techtextil 2017
productronica 2017
COMPAMED 2017
Agritechnica 2017
European 3D Summit 2018
embedded world 2018
LOPEC 2018
SEMICON China 2018
Smart Systems Integration 2018
HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
SENSOR+TEST 2018
SEMICON West 2018
MEMS Sensing & Network System 2018
COMPAMED 2018
electronica 2018
SEMICON Europa 2018
3D & Systems Summit 2019
Intec 2019
LOPEC 2019
Smart Systems Integration 2019
BioCHIP 2019
Paris Air Show 2019
SENSOR+TEST 2019
SEMICON West 2019
IMTC 2019
MST-Kongress 2019
Agritechnica 2019
SEMCION Europa 2019
COMPAMED 2019
MEMS Sensing & Network System 2020
mtex+ 2020
SENSOR+TEST 2020
MEMS Sensing & Network Systems 2021
MEF 2021
Fraunhofer Solution Days 2020
virtual.COMPAMED 2020
COMPAMED 2021
SEMICON Europa 2021
SENSOR+TEST 2021
LOPEC 2021
MEMS Sensing & Network System 2022
InPrint Munich 2022
LOPEC 2022
Smart Systems Integration 2022
SENSOR+TEST 2022
HANNOVER MESSE 2022
FC³ Fuel Cell Conference Chemnitz
techtextil 2022
ILA Berlin Air Show 2022
Farnborough International Airshow 2022
COMPAMED 2022
SEMICON Europa 2022
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Business Units and Functional Teams
Process, Device and Packaging Technologies
Prof. Dr. Stefan E. Schulz
Dr. Jörg Schuster
Dr. Danny Reuter
Prof. Dr. Karla Hiller
Dr. Maik Wiemer
Dr. Sascha_Hermann
Dr. Patrick Matthes
Birgit Weber
Mareen Bunar
Yvonne Ostmeier-Ullmann
Intelligent Sensor and Actuator Systems
Dr. Roman Forke
Andreas Morschhauser
Dr. Jörg Martin
Dr. Christan Hedayat
Dr. Alexander Weiß
Michaela Fohl
Systems and Applications
Rainer Kaltschmidt
Dr. Mario Braun
Alissa Hölzl
Prof. Dr. Ralf Zichner
Dr. Mario Baum
Diana Maier
Cross-Functional Topics
Functional Team Artificial Intelligence
Functional Team »Reliability«
Dr. Jan Langer
Prof. Dr. Harald Kuhn
Romy Weller
Josephine Steger
Prof. Dr. Sven Rzepka
Prof. Dr. Thomas Otto
Dr. Ramona Ecke
Michael Schubert
Corporate Strategy
Dr. Martina Vogel
Dr. Steffen Kurth
Dr. Christian Wagner
Prof. Dr. Harald Kuhn
Denny Löffler
Alexander Schade
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Process, Device and Packaging Technologies
Simulation
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3D/MEMS Packaging
Wafer-to-Wafer-Bonding
Characterization of Bonding
3D Integration
Parylene Based Packaging
MEMS Technology Platforms
Piezoelectric Microsystems
Bonding and Deep RIE
Airgap insulated microstructures
Bulk Micromachining
Membrane based devices
Nanotechnological Components and Systems
Platform for 1D/2D Nanostructures
1D/2D Nanodevices
Heterogeneous Integration of Nanodevices
Spintronic Devices
Nanotechnological Components and Systems
Intelligent Sensor and Actuator Systems
Inertial Components and Systems
Acceleration Sensors
Vibration Sensors
High Precision MEMS Angular Rate Sensor
Microfluidic for Lab-on-Chip Systems
Biosensor Integration
Assay Integration
Fabrication of microfluidic systems
Optical Components and Systems
Spectral Components
Sensor and Imaging Systems
Service: Material and Surface Characterization
Hybrid and Wireless Sensors and Systems
Wireless multi-sensor systems
Wireless Power Transfer
Hybrid Sensors
RF Components and Systems
RF MEMS Switch
RF MEMS characterization
Accoustic Components
CMUT - Capacitive micromechanical ultrasonic transducer
PMUT – A new generation of ultrasonic transducers
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Flexible and integrable electronics
CCM, MEA and biomedical sensors
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Medicine and medical technology Applications
Semiconductor Industry, Microsystems Technology, System Providers
Mechanical engineering, robotics
Energy
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Reliability
Lifetime Test and Modeling
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Reliability of Components and Systems
Artificial Intelligence
Acceleration through AI
Sensor-based data fusion
Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
Implementation of a Novel Magnetic Field-Based Location Method Using AI
Preliminary Research
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Prof. Dr. Stefan E. Schulz
Head of Business Unit »Process, Device and Packaging Technologies«
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Dr. Alexander Weiß
Head of Business Unit »Intelligent Sensor and Actuator Systems«
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Rainer Kaltschmidt
Head of Business Unit »Systems and Applications«
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Functional Teams
Dr. Jan Langer
Head of Functional Team »Artificial Intelligence«
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Prof. Dr. Sven Rzepka
Head of Functional Team »Reliability«
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Fraunhofer Institute for Electronic Nano Systems