Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems

Equipment Overview

© Fraunhofer ENAS
Deep etcher, metal etcher, and ion beam etcher at Fraunhofer ENAS

The equipment fleet at Fraunhofer ENAS includes 12 tools in the area of dry etching. Depending on the tool, our experts utilize a total of six different principles and seven different "chemistries" to structure or remove a wide selection of materials. Depending on the tool and the chamber, selected in situ diagnostic systems are used to determine endpoints in real time and to analyze process data for further adjustment and optimization.

 

Technology Tool Precursor Material
DRIE OMEGA, STS Multiplex Fluorine-based (SF6, CF4, C4F8, CHF3) Si, SiO2, Si3N4, W, Ta, Ti, Ag
RIE (CCP) Leybold, eMxP+ (Centura), FHR (Metal) Chlorine-based (Cl2, BCl3) Al, AlN, Pt, AlSi, AlSiCu, Ti, Cr, TiO2, Si, Si3N4
ICP Oxford, Sentech, DPS (Centura), FHR (Oxide) Methane-based (CH4) ITO, (Cu, Ag)
Remote / Down Stream Tepla, R3T, ASP (Centura) Oxygen-based (O2) Resist, DLC, Parylene, Cr, Ru, CNTs
Vapor Phase Etching ORBIS 3000 Hydrogen-based (H2) Photoresist, (Si)
Ionenstrahlätzen (IBE) IBE (Scia) HF (gas phase) SiO2