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Fraunhofer Institute for Electronic Nano Systems
Fraunhofer Institute for Electronic Nano Systems
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2017-06-28_Leti_and_Fraunhofer
2017-07-05_EU Project EuroPAT-MASIP
2017-08-30_COMPAMED2017_ProjectMIDARDI
2017-09-19_MonitoringSystemElectroplatingSolutions_MSNS2017
2018-03-14_For high-efficient computers using nanoscale biomolecules
2018-04-10_ILA-BerlinAirShow2018
2018-04-12_SSI2018_FinalReport
2018-06-20_MircoProfTL_FRT+FraunhoferENAS_Sensor+Test2018
2018-12-17_FraunhoferENAS_Research_Award_2018
2018_12_17_Tohoku_University
2018_12_17_Minapim_Brasilien
2019-03-28_Globalfoundries, Fraunhofer-Gesellschaft und Next Big Thing gründen Start-up in Dresden
2019_04_23_First Time - Thomas Gessner Award at SSI2019 granted
2019-06-19_Al-Electroplating_SENSOR+TEST2019
2019-06-20_Near-field-measurment_Sensor+Test2019
2019-06-21_AlN-Technology_SENSOR+TEST2019
2019-09-17_GoBeyond4.0
2019-11-07_Memristor Whitepaper
2020-11-05_Project_M3Infekt_FraunhoferENAS
2020-11-12_Pressrelease_Fraunhofer-ENAS-virtualCOMPAMED2020
2020-12-17_PressRelease_ResearchAward2020_FraunhoferENAS
2021-03-22 Fraunhofer ENAS at LOPEC 2021
2021_04_30_Smart Systems Integration
2021-05-03 SENSOR+TEST 2021
2021-05-18 Press Release Fraunhofer Cooperation Ultrasonic Transducer
2021-06-10 Best Paper Award SSI2021
2021-06-04 Press release TKOS FMD
2021-07-01 Press release Miniature spectrometer for the smartphone
2021-11-15_Ultra-thin_flexible_Parylene-based_PCB
2022-01-28_Inductive-Bonding
2022-03-01_InkjetPrinting_LOPEC2022
2022-04-07_Continuation of the Micro/Nano Performance Center
2022-06-28_Fraunhofer ENAS awards development of piezoelectric aluminum nitride MEMS platform with Fraunhofer ENAS Research Award 2021
2022-07-21_Announcement Smart Systems Integration 2023 and Award Winners of the Smart Systems Integration Conference SSI2022 in Grenoble
2022-07-28_Fraunhofer ENAS extends cooperation with memsstar
2022-10-13_Recyclable food packaging: quality control for nanocoatings
2022-11-10_Harald-Kuhn_Chairman-Advisory-Board-IVAM
2022-12-08_Research Fab for quantum and neuromorphic computing: Launch of the Germany-wide cooperation FMD-QNC
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intec 2023
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Workshop - Air Pulses without Pressurized Air
APPLAUSE Heterogeneous Integration Summer School
CMP and WET Users' Group Meeting 2022
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MEMS Sensing & Network System 2016
SEMICON Europa 2016
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European 3D Summit 2017
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SEMIEXPO Russia 2017
International Paris Air Show 2017
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MEMS Sensing & Network System 2017
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techtextil 2017
productronica 2017
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Agritechnica 2017
European 3D Summit 2018
embedded world 2018
LOPEC 2018
SEMICON China 2018
Smart Systems Integration 2018
HANNOVER MESSE 2018
ILA - Berlin Air Show 2018
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SEMICON West 2018
MEMS Sensing & Network System 2018
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electronica 2018
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SENSOR+TEST 2019
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Agritechnica 2019
SEMCION Europa 2019
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mtex+ 2020
SENSOR+TEST 2020
MEMS Sensing & Network Systems 2021
MEF 2021
Fraunhofer Solution Days 2020
virtual.COMPAMED 2020
COMPAMED 2021
SEMICON Europa 2021
SENSOR+TEST 2021
LOPEC 2021
MEMS Sensing & Network System 2022
InPrint Munich 2022
LOPEC 2022
Smart Systems Integration 2022
SENSOR+TEST 2022
HANNOVER MESSE 2022
FC³ Fuel Cell Conference Chemnitz
techtextil 2022
ILA Berlin Air Show 2022
Farnborough International Airshow 2022
COMPAMED 2022
SEMICON Europa 2022
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Process, Device and Packaging Technologies
Prof. Dr. Stefan E. Schulz
Dr. Jörg Schuster
Dr. Danny Reuter
Prof. Dr. Karla Hiller
Dr. Maik Wiemer
Dr. Sascha_Hermann
Dr. Patrick Matthes
Birgit Weber
Mareen Bunar
Yvonne Ostmeier-Ullmann
Intelligent Sensor and Actuator Systems
Dr. Roman Forke
Andreas Morschhauser
Dr. Jörg Martin
Dr. Christan Hedayat
Dr. Alexander Weiß
Michaela Fohl
Systems and Applications
Rainer Kaltschmidt
Dr. Mario Braun
Alissa Hölzl
Prof. Dr. Ralf Zichner
Dr. Mario Baum
Diana Maier
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Functional Team »Reliability«
Dr. Jan Langer
Prof. Dr. Harald Kuhn
Romy Weller
Josephine Steger
Prof. Dr. Sven Rzepka
Prof. Dr. Thomas Otto
Dr. Ramona Ecke
Michael Schubert
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Dr. Martina Vogel
Dr. Steffen Kurth
Dr. Christian Wagner
Prof. Dr. Harald Kuhn
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Acceleration Sensors
Vibration Sensors
High Precision MEMS Angular Rate Sensor
Microfluidic for Lab-on-Chip Systems
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Optical Components and Systems
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CMUT - Capacitive micromechanical ultrasonic transducer
PMUT – A new generation of ultrasonic transducers
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Demonstrator: Digital Twin Chemical Mechanical Polishing (CMP)
Integratable Spectral Sensing in Multi-Reactor Technology - Result Interpretation Using Neural Networks
AI-Supported Development of Electronic Systems for Future Vehicle Generations in the progressivKI Project
Implementation of a Novel Magnetic Field-Based Location Method Using AI
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© 2018 Shutterstock
AI-supported development of electronic systems for future vehicle generations in the progressivKI project.
more about AI-supported development
© Fraunhofer ENAS
Implementation of a novel magnetic field-based location method using AI
More about Implementation of a novel magnetic
Fraunhofer Institute for Electronic Nano Systems