Wir laden Sie zu unserem
25. Chemnitzer Seminar
für Nanotechnology, Nanomaterials und Nanoreliability
herzlich ein und begrüßen Sie am
am 14. und 15. Juni 2016 in Chemnitz
Ort: Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz
Thema: System Integration Technologies
Programm:
Dienstag, 14. Juni 2016
13:00 – 13:20 Uhr | Packaging of MEMS Devices – An Overview Dr. Maik Wiemer, Fraunhofer ENAS |
13:20 – 13:50 Uhr | Nanotechnology for its Convergence and Applications Prof. Jong Min Kim, University of Cambridge |
13:50 – 14:20 Uhr | Developments, Applications and Challenges for the Industrial Implementation of Nanoimprinting Lithography Dr. Martin Eibelhuber, EV Group E. Thallner GmbH |
14:20 – 14:50 Uhr | Vertically-Integrated Array-Type Miniature Interferometer as a Core Optical Component of a Coherence Tomography System for Tissue Inspection Dr. Wei-Shan Wang, Fraunhofer ENAS |
14:50 – 15:20 Uhr | Mobile Medical Devices for the Internet of Things – Design Challenges Tilo Borchardt, GETEMED Medizin- und Informationstechnik AG |
15:20 – 15:50 Uhr | Kaffeepause und Networking |
15:50 – 16:20 Uhr | Actual Hearing Aid Technologies – Technical Innovations on Smallest Space Jens Heese, Hansaton Akustik GmbH |
16:20 – 16:50 Uhr | NiC: A New Functional Layer with High Sensitivity for Pressure and Force Sensors Dr. Ralf Koppert, Siegert Thinfilm Technology |
16:50 – 17:20 Uhr | Separation of SiC Wafer using Thermal Laser Separation Ronny Neubert, 3D‑Micromac AG |
17:20 – 17:50 Uhr |
Implantable Pressure Sensors Dr. Reza Bahmanyar, Imperial College London |
19:00 Uhr | Abendveranstaltung |
Mittwoch, 15. Juni 2016
9:00 – 9:10 Uhr |
Welcome Dr. Maik Wiemer, Fraunhofer ENAS |
9:10 – 9:40 Uhr | Temporary Wafer Bonding - Key Technology for 3D-MEMS integration Dirk Wünsch, Fraunhofer ENAS |
9:40 – 10:10 Uhr | Beyond State-of-the-Art: Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP) Steffen Kröhnert, NANIUM S.A. |
10:10 – 10:40 Uhr |
TagItSmart - Creating IoT for mass market products Dr. Srdjan Krco, DUNAV NET |
10:40 – 11:10 Uhr |
Printing of Electrical Functional Structures by using Aerosol-Jet Frank Roscher, Fraunhofer ENAS |
11:10 – 11:40 Uhr |
Kaffeepause und Networking |
11:40 – 12:10 Uhr |
Solder Jetting, Rework & electroless UBM Deposition Made in Germany Sebastian Hahn, PacTech – Packaging Technologies GmbH |
12:10 – 12:40 Uhr | Soldering of MEMS and Silicon Interposers: The Role of Intermetallic Compounds Maaike M. Visser Taklo, SINTEF ICT Instrumentation Dept. |
12:40 – 13:10 Uhr | Design and Applications of Linear Microphone Arrays Dr. Matthias Domke, Microtech Gefell GmbH |
13:10 – 13:40 Uhr |
How Can Process Control Help to Increase Yield for Advanced Packages like WLCSP, SIP, FO-WLP? Pieter Vandewalle, KLA-Tencor GmbH |
13:40 Uhr | Abschluss und Mittagessen |