22. Chemnitzer Seminar
Chemnitzer Seminar „System Integration Technologies“
Smart systems are becoming more and more important in our daily life, e.g. in cars, efficient energy management, security applications, medical engineering, logistics and other applications.
A major bottleneck, however, to allow these devices to hit the market, is the packaging of the sensitive microstructures to a rugged outer casing that makes handling possible and allow them to withstand even harsh environments. On this path, many unexpected challenges are encountered when interfacing the system structure to the outer world.
The focus of the 22nd Chemnitzer Seminar is to discuss and show paths to solve these challenges.
Program
June, 23rd 2015
- 1:00 – 1:20 pm Packaging of MEMS devices – An overview | Dr. Maik Wiemer, Fraunhofer ENAS
- 1:20 – 1:55 pm Open TSV technology for 3D sensor applications | Jörg Siegert, ams AG
- 1:55 – 2:20 pm Packaging of integrated photonic devices; applications, user foundry services and design rules | Dr. Peter O‘Brien, University College Cork
- 2:20 – 2:45 pm Silver sinter interconnects in diversified applications | Thomas Krebs, Heraeus Deutschland GmbH & Co. KG
- 2:45 – 3:10 pm 16Mpixel 3D stacked CMOS image sensor | Toru Kondo, Olympus
- 3:40 – 4:05 pm Towards MEMS loudspeaker fabrication by using metallic glass thin films | Felix Gabler, Fraunhofer ENAS
- 4:05 – 4:30 pm MEMS packaging – Infinite variety of bonding applications | Margarete Zoberbier, SUSS MicroTec Lithography GmbH
- 4:30 – 4:55 pm Passive RFID sensor solutions | Reinhard Jurisch, Microsensys
- 4:55 – 5:20 pm Geology needs MEMS and sensors | Dr. Dieter Rammlmair, Federal Institute for Geosciences and Natural Resource
June 24th 2015
- 9:10 – 9:35 am MEMS-based industry 4.0 applications | Sven Bochmann, Turck Duotec GmbH
- 9:35 – 10:00 am Large-area patterning by roller-based nanoimprint lithography | Dr. Ursula Palfinger, JOANNEUM RESEARCH Forschungsgesellschaft mbH
- 10:00 – 10:25 am Applications of thermal nano imprint lithography | Steffi Proschwitz, University of Applied Sciences Zwickau
- 10:55 – 11:20 am Oxide free direct wafer bonding | Dr. Martin Eibelhuber, EV Group
- 11:20 – 11:45 am Telecardiology – Technical innovations and challenges in clinical practice | Dr. Axel Müller, Klinikum Chemnitz
- 11:45 – 12:10 pm Packaging and fabrication opportunities enabled by the room temperature deposition of Parylene | Marco Haubold, Fraunhofer ENAS
- 12:10 – 12:35 pm MEMS and biological cells – advances in designing sensors, actuators and biocompatible surfaces for medical use | Prof. Dr. Richard Funk, Technische Universität Dresden
- 12:35 – 1:00 pm Thales vision and need in advanced packaging for high end applications | Michel Brizoux, Thales Global Services