Hybrid Integration of LED on optics

32. Chemnitzer Seminar

Wir laden Sie recht herzlich zu unserem


»MEMS Technologies and Applications«

21.-22. Mai 2019

am Fraunhofer-Institut für Elektronische Nanosysteme ENAS ein.


Dienstag, 21. Mai 2019

12:30 - 12:40 Uhr pm Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
12:40 - 1:10 Uhr pm

Keynote: Trends and Challenges in MEMS Integration
Emilie Jolivet, Yole Développement

1:10 - 1:40 Uhr pm MEMS based Photo-Acoustic Gas Sensor
Dr. Rainer Schaller, InfineonTechnologies AG
1:40 - 2:10 Uhr pm Advanced Surface Micromachining Process – a First Step towards 3D MEMS
Dr. Jörg Bräuer, Robert Bosch GmbH
2:10 - 2:50 Uhr pm Poster and Demonstrator Presentation, Coffee Break and Networking
2:50 - 3:20 Uhr pm Keynote: Quality and Reliability Testing of Wirebonds – Limitations and  new Opportunities
Stefan Schmitz, Bond-IQ GmbH
3:20 - 3:50 Uhr pm Organic and Flexible Sensors in Applications
Dr. Dominik Gronarz, Organic Electronics Saxony Management GmbH
3:50 - 4:20 Uhr pm Capacitive Micromachined Ultrasonic Transducers for Medical and Non- Medical Applications
Dr. Nooshin Saeidi, Fraunhofer ENAS
4:20 - 4:50 Uhr pm Transferring Research Knowledge to Clinical Practice – Challenges and Chances
Dr. Marcus Binner, TissueGUARDTeam

Mittwoch, 22. Mai 2019

8:30 -  8:40 Uhr am Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
8:40 -  9:10 Uhr am

Keynote: From Sampling to Ramping – Technology and Business Model Challenges for MEMS Foundries to Address WLP Applications
Volker Herbig, X-FAB Semiconductor Foundries AG 

9:10 - 9:40 Uhr am Sensor Development for Space Applications – Challenges and Opportunities
Robin Schmidt, Jena- Optronik GmbH
9:40 - 10:10 Uhr am Wafer-Level Ag-Ag Thermocompression Bonding and Its Evaluation
Prof. Jörg Frömel, Tohoku University
10:10 - 10:40 Uhr am Poster and Demonstrator Presentation, Coffee Break and Networking
10:40 - 11:10 Uhr am Keynote: Huawei R&D – Areas of Interest, Cooperation Models and Best Practices
Dr. Andrea Sanfilippo, Huawei Europe
11:10 - 11:40 Uhr am Current Funding Opportunities in Electronics and MEMS
Dr. Gregor Schwartz, VDI/VDE Innovation + Technik GmbH
11:40 - 12:10 Uhr pm 3D Printed Electronics for Mechatronic Systems
Dr. Martin Hedges, Neotech AMT GmbH
12:10 - 12:40 Uhr pm Building-in Reliability into Power Modules
Dr. Jacek Rudzki, Danfoss Silicon Power GmbH
12:40 - 1:40 Uhr pm Lunch
1:40 - 2:10 Uhr pm Electrodeposition of Aluminum Towards Wafer-Level Al- l Thermocompression Bonding
Silvia Hertel, Fraunhofer ENAS
2:10 - 2:40 Uhr pm Discussion and End of Workshop
from 2:40 Uhr pm Individual Lab and Window Tours



Bis zum 16. April können Sie unter dem Passwort »Seminar System Packaging« oder mit dem beiliegenden Anmeldeformular (Registrierungsanfrage) ein Zimmer im Hotel »Chemnitzer Hof« reservieren

Einzelzimmer (inkl. Frühstück) 69 EUR.

Hotel Chemnitzer Hof, Theaterplatz 4, 09111 Chemnitz

Tel.: +49 371 684-0
E-Mail: info@chemnitzer-hof.de