We invite you to our
»Materials and Technologies for MEMS Packaging«
on June 12 and 13, 2018
Venue: Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz
Smart systems are becoming more and more important in our daily life, e.g. in cars, security applications, medical engineering, condition monitoring, logistics and other applications. A major bottleneck, however, is the packaging of the sensitive microstructures on different levels to allow them to withstand even harsh environments and meet the competitive market requirements. In 2018 advanced electronic packaging materials, novel processes and technologies will be highlighted within the 28th Chemnitzer Seminar. On June 14, our cooperation partner Electronic Design Chemnitz GmbH will held a workshop about »Smart Sensor Technologies«. Find more information online: www.ed-chemnitz.de.