27. Chemnitzer Seminar

We invite you to our

CHEMNITZER SEMINAR
»System Integration Technologies«

on June 13 and 14, 2017
Venue: Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz


Smart systems are becoming more and more important in our daily life, e.g. in cars, efficient energy management, security applications, medical engineering, logistics and other applications. A major bottleneck, however, is the packaging of the sensitive microstructures on different levels to allow them to withstand even harsh environments and meet market requirements. On this path, many unexpected challenges are encountered when interfacing the system structure to the outer world. The focus of the 27th Chemnitzer Seminar is to discuss topics like packaging technologies for MEMS and devices for medical applications Furthermore an introduction to the New Zealand perspective in the field of smart systems will be given.

Program Tuesday, June 13, 2017

1:00 – 1:20 pm

Research activities at department system packaging – a project overview

Dr. Maik Wiemer, Fraunhofer ENAS

1:20 – 1:50 pm

Smart sensor system for robotic applications

Prof. Shuji Tanaka, Tohoku University

1:50 – 2:20 pm

Additive Manufacturing using biobased materials

Prof. Henning Zeidler, Technische Universität Bergakademie Freiberg

2:20 – 2:50 pm

Structuring and bonding of glass-wafer

Dr. Anke Sanz-Velasco, IMT Masken und Teilungen AG

2:50 – 3:20 pm

Coffee break and networking

3:20 – 3:50 pm

Character projection e-beam lithography for wafer level nano-fabrication

Uwe Hübner, Leibniz-Institut für Photonische Technologien e.V.

3:50 – 4:20 pm

A New Zealand perspective – research, development and collaborative work with Fraunhofer ENAS

Dr. Ian Woodhead, Lincoln Agritech Ltd.

4:20 – 4:50 pm

Secure Hardware Toolbox – Tamper respondent envelope solution by additive manufacturing

Frank Roscher, Fraunhofer ENAS

4:50 – 5:20 pm

Possibilities for fruitful cooperations – High performance Center for Functional Integration of Micro- and Nanoelectronics in Dresden and Chemnitz

Prof. Stefan E. Schulz, Fraunhofer ENAS

 

Program Wednesday, June 14, 2017

9:00 – 9:10 am

Welcome

Dr. Maik Wiemer, Fraunhofer ENAS

9:10 – 9:40 am

Advanced Packaging Technologies at Beijing University

Prof. Yufeng Jin, Peking University

9:40 – 10:10 am

Highly miniaturized multi sensor system for biomedical applications

Dr. Mario Baum, Fraunhofer ENAS

10:10 – 10:40 am

Ultrasound assisted micro-endoscopy for medical applications

Dr. Nooshin Saeidi, Fraunhofer ENAS

10:40 – 11:10 am

Quality and innovation for neuroscientists and clinical professionals

Dr. Rodrigo Sigala, eemagine Medical Imaging Solutions GmbH

11:10 – 12:00 am

Early lunch and networking

12:00 – 12:30 pm

Features of Shinko advanced package and optical sensor developed with Fraunhofer ENAS

Yuichiro Shimizu, Shinko Electric Industries Co., Ltd.

12:30 – 1:00 pm

Chronic wounds: current and future therapy options

Dr. Roxane Schulten, Dr. Ausbüttel & Co. GmbH

1:00 – 1:30 pm

Networking

1:30 – 2:00 pm

Coffee break

from 2:00 pm

Individual Lab and Window Tours

Registration

The registration is free of charge.

Please send an e-mail for registration to events@enas.fraunhofer.de until June 1, 2017.

How to reach us

Fraunhofer ENAS, Technologie-Campus 3, 09126 Chemnitz

Attention - building site:
The access to Technologie-Campus is just possible via Fraunhoferstraße. From direction of A72, follow Neefestraße, turn right into Suedring and turn right into F.-O.-Schimmel-Straße. After the roundabout traffic you follow the Fraunhoferstraße.

Anfahrt Umleitung 27. Chemnitzer Seminar
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Anfahrt Umleitung 27. Chemnitzer Seminar

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