Range of Services

Fraunhofer Institute for Electronic Nano Systems

Processes

  • High temperature processes: Diffusion / thermal oxidation / annealing / RTP
  • Physical Vapour Deposition PVD
  • Sputtering
  • Electron beam evaporation
  • Chemical Vapor Deposition CVD
  • Plasma enhanced CVD (PE-CVD)
  • Low-Pressure CVD (LP-CVD)
  • Metall-Organic CVD (MOCVD)
  • Electroplating: Cu, Ni, Au
  • Etching (dry: Plasma- and RIE-mode & wet: isotropic / anisotropic)
  • Dry etching (Si, SiO2, Si3N4, Polysilicon, Silicides, Al, refr. metals, TiN, Cr, DLC, low k dielectrics)
  • Wet etching (SiO2, Si3N4, Si, Polysilicon, Al, Cr, Au, Pt, Cu, Ti, W )
  • Wafer lithography / Electron beam lithography
  • Chemical Mechanical Polishing CMP (Copper, Silicon, SiO2 )