With the available equipment at Fraunhofer ENAS standard semiconductor and MEMS technologies could be processed as customers order or even as second source. The following processes could be requested:

• Dicing
  Si, glass, special materials
  Compounds (Si-glass, glass-glass, Si-Si, Ceramics, Metals)

• Chip bonding
  Flip chip
  Chip-to-chip (C2C) & chip-to-wafer (C2W)
  Multi-chip-modules (MCM)
  Chip-on-board (COB)
  Surface mounted devices (SMD)

• Wire bonding
  Bonding with thin & thick wires (32 µm…250 µm)
  Al, Au, and Cu wires
  Ultrasonic, thermo compression, and thermosonic bonding

• MEMS Packaging
  Screen printing, spin-on, and dispensing of special materials
  Electrical and mechanical connection
  CMP (Si, SiO2, Al, Cu, Ge)
  Special substrates for electronics
  Prototype manufacturing, small series fabrication
  Characterisation (hermeticity, bond strength, ultrasonic and IR measurements, REM, EDX)

• Nano patterned surfaces
  Nano lawn
  Reactive nano layer systems

• Micro molding and Nano imprinting
  Polymers (PMMA, COC)
  Ceramics (LTCC)
  High precision master tools (Si, Ni)

In the fields of wafer bonding, MEMS Packaging, and integration of complex micro and nano systems (MEMS/NEMS) we offer feasibility studies and market studies, organize workshops and other events for know-how transfer, train the partners in-house but also within their facilities, and, last but not least, we transfer new technologies and processes to the partners fab directly. Further information you will get on request:

• Feasibility and market studies (partly funded)
• Workshops
• Trainings
• Technology transfer