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Services

We offer the following services:

  • Wafer processing
  • R&D service for processes and integration
  • Modelling and simulation of processes and equipment
  • Simulation of interconnect systems
  • Thin film measurement and characterization

 

On the special areas like:

  • Integration of low-k dielectrics
  • Diffusion barriers - Metallization
  • Air Gap structures
  • Through-silicon vias (TSV) for 3D-integration
  • CVD/ALD processes
  • CMP/Planarization
  • Spin-on dielectrics
  • Scaling effects in interconnects
  • Carbon Nanotubes for interconnects and sensors