We offer the following services:

• Wafer processing
• R&D service for processes and integration
• Modelling and simulation of processes and equipment
• Simulation of interconnect systems
• Thin film measurement and characterization

On the special areas like:

• Integration of low-k dielectrics
• Diffusion barriers - Metallization
• Air Gap structures
• Through-silicon vias (TSV) for 3D integration
• CVD / ALD processes
• CMP / Planarization
• Spin-on dielectrics
• Scaling effects in interconnects
• Carbon Nanotubes for interconnects and sensors